P

Inventor

BUYNOSKI MATTHEW S

US104 patents
⚠️ This page may combine multiple inventors who share the name “BUYNOSKI MATTHEW S”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

ADVANCED MICRO DEVICES INC

47 patents
US6709982B1Mar 23, 2004

Double spacer FinFET formation

ADVANCED MICRO DEVICES INC272 citations99
US6645797B1Nov 11, 2003

Method for forming fins in a FinFET device using sacrificial carbon layer

ADVANCED MICRO DEVICES INC273 citations99
US6465334B1Oct 15, 2002

Enhanced electroless deposition of dielectric precursor materials for use in in-laid gate MOS transistors

ADVANCED MICRO DEVICES INC154 citations99
US6765303B1Jul 20, 2004

FinFET-based SRAM cell

ADVANCED MICRO DEVICES INC134 citations98
US6716686B1Apr 6, 2004

Method for forming channels in a finfet device

ADVANCED MICRO DEVICES INC85 citations98
US6562718B1May 13, 2003

Process for forming fully silicided gates

ADVANCED MICRO DEVICES INC107 citations98
US6475874B2Nov 5, 2002

Damascene NiSi metal gate high-k transistor

ADVANCED MICRO DEVICES INC137 citations98
US6376336B1Apr 23, 2002

Frontside SOI gettering with phosphorus doping

ADVANCED MICRO DEVICES INC104 citations98
US6300203B1Oct 9, 2001

Electrolytic deposition of dielectric precursor materials for use in in-laid gate MOS transistors

ADVANCED MICRO DEVICES INC101 citations98
US6207553B1Mar 27, 2001

Method of forming multiple levels of patterned metallization

ADVANCED MICRO DEVICES INC126 citations98
US6518167B1Feb 11, 2003

Method of forming a metal or metal nitride interface layer between silicon nitride and copper

ADVANCED MICRO DEVICES INC81 citations97
US6787458B1Sep 7, 2004

Polymer memory device formed in via opening

ADVANCED MICRO DEVICES INC63 citations96
US6770905B1Aug 3, 2004

Implantation for the formation of CuX layer in an organic memory device

ADVANCED MICRO DEVICES INC56 citations96
US6753247B1Jun 22, 2004

Method(s) facilitating formation of memory cell(s) and patterned conductive

ADVANCED MICRO DEVICES INC53 citations96
US6703307B2Mar 9, 2004

Method of implantation after copper seed deposition

ADVANCED MICRO DEVICES INC55 citations96
US6667552B1Dec 23, 2003

Low dielectric metal silicide lined interconnection system

ADVANCED MICRO DEVICES INC54 citations96
US6518113B1Feb 11, 2003

Doping of thin amorphous silicon work function control layers of MOS gate electrodes

ADVANCED MICRO DEVICES INC73 citations96
US6245658B1Jun 12, 2001

Method of forming low dielectric semiconductor device with rigid, metal silicide lined interconnection system

ADVANCED MICRO DEVICES INC69 citations96
US6246118B1Jun 12, 2001

Low dielectric semiconductor device with rigid, conductively lined interconnection system

ADVANCED MICRO DEVICES INC62 citations96
US6078088AJun 20, 2000

Low dielectric semiconductor device with rigid lined interconnection system

ADVANCED MICRO DEVICES INC85 citations96
US5932911AAug 3, 1999

Bar field effect transistor

ADVANCED MICRO DEVICES INC50 citations96
US5729045AMar 17, 1998

Field effect transistor with higher mobility

ADVANCED MICRO DEVICES INC60 citations96
US7029958B2Apr 18, 2006

Self aligned damascene gate

ADVANCED MICRO DEVICES INC31 citations93
US6977389B2Dec 20, 2005

Planar polymer memory device

ADVANCED MICRO DEVICES INC51 citations93
US6916696B1Jul 12, 2005

Method for manufacturing a memory element

ADVANCED MICRO DEVICES INC23 citations93
US6852586B1Feb 8, 2005

Self assembly of conducting polymer for formation of polymer memory cell

ADVANCED MICRO DEVICES INC26 citations93
US6724087B1Apr 20, 2004

Laminated conductive lines and methods of forming the same

ADVANCED MICRO DEVICES INC19 citations93
US6642590B1Nov 4, 2003

Metal gate with PVD amorphous silicon layer and barrier layer for CMOS devices and method of making with a replacement gate process

ADVANCED MICRO DEVICES INC22 citations93
US6589866B1Jul 8, 2003

Metal gate with PVD amorphous silicon layer having implanted dopants for CMOS devices and method of making with a replacement gate process

ADVANCED MICRO DEVICES INC25 citations93
US6583012B1Jun 24, 2003

Semiconductor devices utilizing differently composed metal-based in-laid gate electrodes

ADVANCED MICRO DEVICES INC33 citations93
US6528362B1Mar 4, 2003

Metal gate with CVD amorphous silicon layer for CMOS devices and method of making with a replacement gate process

ADVANCED MICRO DEVICES INC27 citations93
US6518154B1Feb 11, 2003

Method of forming semiconductor devices with differently composed metal-based gate electrodes

ADVANCED MICRO DEVICES INC34 citations93
US6495887B1Dec 17, 2002

Argon implantation after silicidation for improved floating-body effects

ADVANCED MICRO DEVICES INC26 citations93
US6440867B1Aug 27, 2002

Metal gate with PVD amorphous silicon and silicide for CMOS devices and method of making the same with a replacement gate process

ADVANCED MICRO DEVICES INC23 citations93
US6440868B1Aug 27, 2002

Metal gate with CVD amorphous silicon layer and silicide for CMOS devices and method of making with a replacement gate process

ADVANCED MICRO DEVICES INC25 citations93
US6436840B1Aug 20, 2002

Metal gate with CVD amorphous silicon layer and a barrier layer for CMOS devices and method of making with a replacement gate process

ADVANCED MICRO DEVICES INC31 citations93
US6392280B1May 21, 2002

Metal gate with PVD amorphous silicon layer for CMOS devices and method of making with a replacement gate process

ADVANCED MICRO DEVICES INC38 citations93
US6297157B1Oct 2, 2001

Time ramped method for plating of high aspect ratio semiconductor vias and channels

ADVANCED MICRO DEVICES INC32 citations93
US6291278B1Sep 18, 2001

Method of forming transistors with self aligned damascene gate contact

ADVANCED MICRO DEVICES INC39 citations93
US6271132B1Aug 7, 2001

Self-aligned source and drain extensions fabricated in a damascene contact and gate process

ADVANCED MICRO DEVICES INC41 citations93
US6225667B1May 1, 2001

Leaky lower interface for reduction of floating body effect in SOI devices

ADVANCED MICRO DEVICES INC24 citations93
US6218282B1Apr 17, 2001

Method of forming low dielectric tungsten lined interconnection system

ADVANCED MICRO DEVICES INC39 citations93
US6197687B1Mar 6, 2001

Method of patterning field dielectric regions in a semiconductor device

ADVANCED MICRO DEVICES INC34 citations93
US6194299B1Feb 27, 2001

Method for fabrication of a low resistivity MOSFET gate with thick metal on polysilicon

ADVANCED MICRO DEVICES INC28 citations93
US6187675B1Feb 13, 2001

Method for fabrication of a low resistivity MOSFET gate with thick metal silicide on polysilicon

ADVANCED MICRO DEVICES INC24 citations93
US5864160AJan 26, 1999

Transistor device with reduced hot carrier injection effects

ADVANCED MICRO DEVICES INC23 citations93
US6803267B1Oct 12, 2004

Silicon containing material for patterning polymeric memory element

ADVANCED MICRO DEVICES INC41 citations92

NAT SEMICONDUCTOR CORP

2 patents

ADVANCED MICRO SERVICES INC

1 patent

Showing the top 50 of 104 patents by PatentIndex Score.