Inventor · disambiguated record
Jiayi Shan
Also filed as: SHAN JIAYI
4 granted patents·11 pending applications·16 citations·filing 2005–2013
68Inventor score
Top patents by PatentIndex Score
15 records- 0177US7955699B2Composite materialHODOGAYA CHEMICAL CO LTD·Filed 2006·Granted Jun 7, 2011·4 cites·11 claims
- 0277US7824768B2Carbon fibrous structureHODOGAYA CHEMICAL CO LTD·Filed 2006·Granted Nov 2, 2010·11 cites·7 claims
- 0366US2014121300A1Carbon fibrous conjunct and composite material using thereofHODOGAYA CHEMICAL CO LTD·Filed 2013·Application pending·0 cites
- 0456US2008254296A1Carbon Fibrous Conjunct and Composite Material Using ThereofBUSSAN NANOTECH RES INST INC·Filed 2006·Application pending·0 cites
- 0552US2009023853A1Method for manufacturing aggregates of fine carbon fibersMITSUI BUSSAN·Filed 2007·Application pending·0 cites
- 0651US2009121606A1Electron emission sourceBUSSAN NANOTECH RES INST INC·Filed 2006·Application pending·0 cites
- 0749US2009047428A1Method for manufacturing carbon fibrous structuresBUSSAN NANOTECH RES INST INC·Filed 2006·Application pending·0 cites
- 0848US8007755B2Carbon fibrous structureHODOGAYA CHEMICAL CO LTD·Filed 2009·Granted Aug 30, 2011·0 cites·23 claims
- 0948US2009131575A1Colored polymer compositionBUSSAN NANOTECH RES INST INC·Filed 2006·Application pending·0 cites
- 1048US2009292057A1Composition for reactive injection molding and reactive injection molded articleBUSSAN NANOTECH RES INST INC·Filed 2006·Application pending·0 cites
- 1148US2009226712A1Recycled composite materialBUSSAN NANOTECH RES INST INC·Filed 2006·Application pending·0 cites
- 1247US2009124746A1Thermoplastic elastomeric compositionBUSSAN NANOTECH RES INST INC·Filed 2006·Application pending·0 cites
- 1346US2009152508A1Conductive coating materialBUSSAN NANOTECH RES INST INC·Filed 2006·Application pending·0 cites
- 1445US8173261B2Fine carbon fibrous structureSHAN JIAYI·Filed 2007·Granted May 8, 2012·1 cites·13 claims
- 1540US2006078730A1Carbon fibrous structureBUSSAN NANOTECH RES INST INC·Filed 2005·Application pending·0 cites
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