Inventor
KUDOSE SATORU
JP6 patents
⚠️ This page may combine multiple inventors who share the name “KUDOSE SATORU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
KUDOSE SATORU
4 patentsUS8193627B2Jun 5, 2012
IC chip mounting package provided with IC chip located in device hole formed within a package base member
KUDOSE SATORU2 citations57
US8129825B2Mar 6, 2012
IC chip package employing substrate with a device hole
KUDOSE SATORU3 citations57
US8390104B2Mar 5, 2013
Semiconductor apparatus packaging structure having embossed tape over tab tape, the embossed tape and method of forming the semiconductor apparatus packaging structure
KUDOSE SATORU0 citations37
US8662309B2Mar 4, 2014
Method for packing tab tape, and packing structure for tab tape
KUDOSE SATORU0 citations35