Inventor
YANG JO-WEI
TW8 patents
Patents
8 patentsUS9905597B2Feb 27, 2018
Sensor package structure
KINGPAK TECH INC7 citations83
US8969120B2Mar 3, 2015
Two-stage packaging method of image sensors
KINGPAK TECH INC15 citations81
US10720370B2Jul 21, 2020
Sensor package structure
KINGPAK TECH INC2 citations71
US10340250B2Jul 2, 2019
Stack type sensor package structure
KINGPAK TECH INC6 citations71
US10825851B2Nov 3, 2020
Sensor package structure
KINGPAK TECH INC1 citations61
US9184331B2Nov 10, 2015
Method for reducing tilt of optical unit during manufacture of image sensor
KINGPAK TECH INC1 citations50
US10600830B2Mar 24, 2020
Sensor package structure
KINGPAK TECH INC0 citations40
US8703519B1Apr 22, 2014
Structure and manufacturing method for high resolution camera module
KINGPAK TECH INC0 citations39