Inventor
DEPPISCH CARL L
US26 patents
⚠️ This page may combine multiple inventors who share the name “DEPPISCH CARL L”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
INTEL CORP
22 patentsUS6848172B2Feb 1, 2005
Device and method for package warp compensation in an integrated heat spreader
INTEL CORP41 citations96
US6504723B1Jan 7, 2003
Electronic assembly having solder thermal interface between a die substrate and a heat spreader
INTEL CORP56 citations96
US6504242B1Jan 7, 2003
Electronic assembly having a wetting layer on a thermally conductive heat spreader
INTEL CORP128 citations96
US6751099B2Jun 15, 2004
Coated heat spreaders
INTEL CORP47 citations95
US7362580B2Apr 22, 2008
Electronic assembly having an indium wetting layer on a thermally conductive body
INTEL CORP41 citations92
US7102226B2Sep 5, 2006
Device and method for package warp compensation in an integrated heat spreader
INTEL CORP18 citations92
US7036573B2May 2, 2006
Polymer with solder pre-coated fillers for thermal interface materials
INTEL CORP27 citations92
US6867978B2Mar 15, 2005
Integrated heat spreader package for heat transfer and for bond line thickness control and process of making
INTEL CORP65 citations91
US7672132B2Mar 2, 2010
Electronic packaging apparatus and method
INTEL CORP21 citations89
US6817091B2Nov 16, 2004
Electronic assembly having solder thermal interface between a die substrate and a heat spreader
INTEL CORP13 citations84
US8809181B2Aug 19, 2014
Multi-solder techniques and configurations for integrated circuit package assembly
INTEL CORP7 citations82
US9330999B2May 3, 2016
Multi-component integrated heat spreader for multi-chip packages
INTEL CORP7 citations79
US7256058B2Aug 14, 2007
Device and method for package warp compensation in an integrated heat spreader
INTEL CORP6 citations74
US7704798B2Apr 27, 2010
Electronic assemblies with hot spot cooling and methods relating thereto
INTEL CORP7 citations72
US7489033B2Feb 10, 2009
Electronic assembly with hot spot cooling
INTEL CORP7 citations72
US7219421B2May 22, 2007
Method of a coating heat spreader
INTEL CORP9 citations72
US10651108B2May 12, 2020
Foam composite
INTEL CORP4 citations71
US9257405B2Feb 9, 2016
Multi-solder techniques and configurations for integrated circuit package assembly
INTEL CORP3 citations71
US7160758B2Jan 9, 2007
Electronic packaging apparatus and method
INTEL CORP7 citations70
US7436058B2Oct 14, 2008
Reactive solder material
INTEL CORP7 citations68
US9808875B2Nov 7, 2017
Methods of fabricating low melting point solder reinforced sealant and structures formed thereby
INTEL CORP0 citations50
US10049971B2Aug 14, 2018
Package structure to enhance yield of TMI interconnections
INTEL CORP0 citations48