Inventor

HUA FAY

US49 patents

⚠️ This page may combine multiple inventors who share the name “HUA FAY”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

HUA FAY

INTEL CORP

Capping copper bumps

Nano-sized metals and alloys, and methods of assembling packages containing same

Device and method for package warp compensation in an integrated heat spreader

Electronic assembly having a wetting layer on a thermally conductive heat spreader

Electronic assembly having solder thermal interface between a die substrate and a heat spreader

Techniques for die stacking and associated configurations

Thermal interface material with carbon nanotubes and particles

Electromigration-resistant and compliant wire interconnects, nano-sized solder compositions, systems made thereof, and methods of assembling soldered packages

Electromigration barrier layers for solder joints

Polymer solder hybrid

Electronic assembly having an indium wetting layer on a thermally conductive body

Ball-limiting metallurgies, solder bump compositions used therewith, packages assembled thereby, and methods of assembling same

Methods to deposit metal alloy barrier layers

Device and method for package warp compensation in an integrated heat spreader

Polymer with solder pre-coated fillers for thermal interface materials

Integrated heat spreader package for heat transfer and for bond line thickness control and process of making

Sam assisted selective e-less plating on packaging materials

Apparatus to minimize thermal impedance using copper on die backside

Electromigration barrier layers for solder joints

Electronic assembly having solder thermal interface between a die substrate and a heat spreader

Ball-limiting metallurgies, solder bump compositions used therewith, packages assembled thereby, and methods of assembling same

Thermal interface apparatus, systems, and methods

Capillary underflow integral heat spreader

Device and method for package warp compensation in an integrated heat spreader

Solders with surfactant-refined grain sizes, solder bumps made thereof, and methods of making same

Device and system for heat spreader with controlled thermal expansion

Low temperature microelectronic die to substrate interconnects

System on package architecture including structures on die back side

Local dense patch for board assembly utilizing laser structuring metallization process

Electronic assemblies with hot spot cooling and methods relating thereto

Electronic assembly with hot spot cooling

Reactive solder material

Electronic devices with components formed by late binding using self-assembled monolayers

Method for compensating for CTE mismatch using phase change lead-free super plastic solders

Device with out-plane inductors

System on package architecture including structures on die back side

Electronic devices with components formed by late binding using self-assembled monolayers

Non-planar on-package via capacitor

Interconnect shunt used for current distribution and reliability redundancy

Interconnect shunt used for current distribution and reliability redundancy

Composite solder TIM for electronic package

Solder contacts for socket assemblies

Solder contacts for socket assemblies

HUA FAY

Electromigration-resistant and compliant wire interconnects, nano-sized solder compositions, systems made thereof, and methods of assembling soldered packages

Low temperature solder metallurgy and process for packaging applications and structures formed thereby

Apparatus to minimize thermal impedance using copper on die backside

AGILENT TECHNOLOGIES INC

Mixed solder pastes for low-temperature soldering process

FITZGERALD TOM

Composite solder TIM for electronic package

NINGBO S J ELECTRONICS CO LTD

Thermal interface material layer and use thereof