Inventor
TRONIC TRISTAN A
US19 patents
Patents
19 patentsUS10937689B2Mar 2, 2021
Self-aligned hard masks with converted liners
INTEL CORP7 citations84
US11004982B2May 11, 2021
Gate for a transistor
INTEL CORP5 citations73
US11764306B2Sep 19, 2023
Multi-layer crystalline back gated thin film transistor
INTEL CORP2 citations72
US11152514B2Oct 19, 2021
Multi-layer crystalline back gated thin film transistor
INTEL CORP3 citations72
US10256141B2Apr 9, 2019
Maskless air gap to prevent via punch through
INTEL CORP3 citations72
US12396254B2Aug 19, 2025
Stacked 2D CMOS with inter metal layers
INTEL CORP1 citations63
US11869894B2Jan 9, 2024
Metallization structures for stacked device connectivity and their methods of fabrication
INTEL CORP0 citations62
US11742429B2Aug 29, 2023
Thin-film transistors with low contact resistance
INTEL CORP0 citations62
US11594485B2Feb 28, 2023
Local interconnect with air gap
INTEL CORP0 citations62
US11430814B2Aug 30, 2022
Metallization structures for stacked device connectivity and their methods of fabrication
INTEL CORP0 citations62
US11189733B2Nov 30, 2021
Thin-film transistors with low contact resistance
INTEL CORP0 citations62
US10971394B2Apr 6, 2021
Maskless air gap to prevent via punch through
INTEL CORP0 citations62
US12119409B2Oct 15, 2024
Multi-layer crystalline back gated thin film transistor
INTEL CORP0 citations61
US11152254B2Oct 19, 2021
Pitch quartered three-dimensional air gaps
INTEL CORP0 citations61
US11107764B2Aug 31, 2021
Group III-V semiconductor fuses and their methods of fabrication
INTEL CORP0 citations61
US12087836B2Sep 10, 2024
Contact over active gate structures with metal oxide-caped contacts to inhibit shorting
INTEL CORP0 citations60
US11837644B2Dec 5, 2023
Contact over active gate structures with metal oxide-caped contacts to inhibit shorting
INTEL CORP0 citations60
US12183831B2Dec 31, 2024
Self-aligned contacts for thin film transistors
INTEL CORP0 citations51
US11201114B2Dec 14, 2021
Methods of forming thin film resistor structures utilizing interconnect liner materials
INTEL CORP0 citations46