Inventor

HASHIZUME KAYO

JP7 patents

Patents

7 patents

US10225931B2Mar 5, 2019

Substrate for printed circuit board, printed circuit board, and method for producing substrate for printed circuit board

SUMITOMO ELECTRIC INDUSTRIES1 citations61

US12538432B2Jan 27, 2026

Printed wiring board

SUMITOMO ELECTRIC INDUSTRIES0 citations60

US12016132B2Jun 18, 2024

Base material for printed circuit board and method of manufacturing base material for printed circuit board

SUMITOMO ELECTRIC INDUSTRIES0 citations59

US10889086B2Jan 12, 2021

Resin film, substrate for printed wiring board, and printed wiring board

SUMITOMO ELECTRIC INDUSTRIES0 citations59

US12058812B2Aug 6, 2024

Substrate for a printed wiring board

SUMITOMO ELECTRIC INDUSTRIES0 citations53

US10244627B2Mar 26, 2019

Substrate for printed wiring board and method for producing the same, printed wiring board and method for producing the same, and resin base material

SUMITOMO ELECTRIC INDUSTRIES0 citations51

US10596782B2Mar 24, 2020

Substrate for printed circuit board and printed circuit board

SUMITOMO ELECTRIC INDUSTRIES0 citations40