Inventor
EOM JOOYANG
KR8 patents
Patents
8 patentsUS11984424B2May 14, 2024
Semiconductor packages using package in package systems and related methods
SEMICONDUCTOR COMPONENTS IND LLC2 citations71
US11430777B2Aug 30, 2022
Power module package for direct cooling multiple power modules
SEMICONDUCTOR COMPONENTS IND LLC2 citations71
US12417999B2Sep 16, 2025
Semiconductor packages using package in package systems and related methods
SEMICONDUCTOR COMPONENTS IND LLC0 citations61
US12230601B2Feb 18, 2025
High power module package structures
SEMICONDUCTOR COMPONENTS IND LLC0 citations61
US12205918B2Jan 21, 2025
Submodule semiconductor package
SEMICONDUCTOR COMPONENTS IND LLC0 citations61
US11264311B2Mar 1, 2022
Clips for semiconductor package and related methods
SEMICONDUCTOR COMPONENTS IND LLC0 citations61
US12308364B2May 20, 2025
Power module package for direct cooling multiple power modules
SEMICONDUCTOR COMPONENTS IND LLC0 citations60
US11848320B2Dec 19, 2023
Power module package for direct cooling multiple power modules
SEMICONDUCTOR COMPONENTS IND LLC0 citations60