Inventor
KO TAE-HO
KR7 patents
⚠️ This page may combine multiple inventors who share the name “KO TAE-HO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRO MECH
4 patentsUS10026681B2Jul 17, 2018
Fan-out semiconductor package
SAMSUNG ELECTRO MECH63 citations96
US10276467B2Apr 30, 2019
Fan-out semiconductor package
SAMSUNG ELECTRO MECH3 citations71
US9674969B2Jun 6, 2017
Flexible printed circuit board and manufacturing method thereof
SAMSUNG ELECTRO MECH0 citations50
US9578740B2Feb 21, 2017
Copper clad laminate, printed circuit board, and method of manufacturing the same
SAMSUNG ELECTRO MECH0 citations36
SAMSUNG ELECTRONICS CO LTD
3 patentsUS11594505B2Feb 28, 2023
Semiconductor package substrate and method of manufacturing semiconductor package using the same
SAMSUNG ELECTRONICS CO LTD0 citations61
US11114397B2Sep 7, 2021
Semiconductor package substrate and method of manufacturing semiconductor package using the same
SAMSUNG ELECTRONICS CO LTD0 citations61
US12381172B2Aug 5, 2025
Semiconductor package and fabricating method thereof
SAMSUNG ELECTRONICS CO LTD0 citations50