Inventor
MORIHIRO YOSHIYUKI
JP10 patents
Patents
10 patentsUS4914815AApr 10, 1990
Method for manufacturing hybrid integrated circuits
MITSUBISHI ELECTRIC CORP101 citations96
US4643798AFeb 17, 1987
Composite and circuit board having conductive layer on resin layer and method of manufacturing
MITSUBISHI ELECTRIC CORP33 citations92
US4629681ADec 16, 1986
Method of manufacturing multilayer circuit board
MITSUBISHI ELECTRIC CORP31 citations92
US4752555AJun 21, 1988
Method of manufacturing multilayer circuit board
MITSUBISHI ELECTRIC CORP25 citations88
US4291758ASep 29, 1981
Preparation of boiling heat transfer surface
MITSUBISHI ELECTRIC CORP30 citations88
US4685203AAug 11, 1987
Hybrid integrated circuit substrate and method of manufacturing the same
MITSUBISHI ELECTRIC CORP22 citations82
US4783642ANov 8, 1988
Hybrid integrated circuit substrate and method of manufacturing the same
MITSUBISHI ELECTRIC CORP14 citations73
US5443659AAug 22, 1995
Flux for soldering and solder composition comprising the same and soldering method using the same
MITSUBISHI ELECTRIC CORP10 citations72
US5034569AJul 23, 1991
Multilayer interconnection circuit board
MITSUBISHI ELECTRIC CORP9 citations72
US5175399ADec 29, 1992
Wiring panel including wiring having a surface-reforming layer and method for producing the same
MITSUBISHI ELECTRIC CORP8 citations70