Inventor
BERNARDS ROGER F
US15 patents
⚠️ This page may combine multiple inventors who share the name “BERNARDS ROGER F”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SHIPLEY CO
7 patentsUS5252196AOct 12, 1993
Copper electroplating solutions and processes
SHIPLEY CO134 citations96
US5051154ASep 24, 1991
Additive for acid-copper electroplating baths to increase throwing power
SHIPLEY CO67 citations92
US4932518AJun 12, 1990
Method and apparatus for determining throwing power of an electroplating solution
SHIPLEY CO25 citations92
US5068013ANov 26, 1991
Electroplating composition and process
SHIPLEY CO34 citations90
US4897165AJan 30, 1990
Electroplating composition and process for plating through holes in printed circuit boards
SHIPLEY CO21 citations82
US5004525AApr 2, 1991
Copper electroplating composition
SHIPLEY CO12 citations73
US5395652AMar 7, 1995
Plating catalyst formed from noble metal ions and bromide ions
SHIPLEY CO3 citations56
ELECTROCHEMICALS INC
4 patentsUS7108795B2Sep 19, 2006
Composition and method for preparing chemically-resistant roughened copper surfaces for bonding to substrates
ELECTROCHEMICALS INC17 citations90
US6946027B2Sep 20, 2005
Composition and method for preparing chemically-resistant roughened copper surfaces for bonding to substrates
ELECTROCHEMICALS INC18 citations90
US6716281B2Apr 6, 2004
Composition and method for preparing chemically-resistant roughened copper surfaces for bonding to substrates
ELECTROCHEMICALS INC19 citations90
US6623787B2Sep 23, 2003
Method to improve the stability of dispersions of carbon
ELECTROCHEMICALS INC5 citations61
OMG ELECTRONIC CHEMICALS INC
3 patentsUS7563315B2Jul 21, 2009
Composition and method for preparing chemically-resistant roughened copper surfaces for bonding to substrates
OMG ELECTRONIC CHEMICALS INC6 citations70
US7767009B2Aug 3, 2010
Solution and process for improving the solderability of a metal surface
OMG ELECTRONIC CHEMICALS INC3 citations60
US7591956B2Sep 22, 2009
Method and composition for selectively stripping nickel from a substrate
OMG ELECTRONIC CHEMICALS INC3 citations52