Inventor
HONG SOONIL
US4 patents
Patents
4 patentsUS6191026B1Feb 20, 2001
Method for submicron gap filling on a semiconductor substrate
APPLIED MATERIALS INC155 citations98
US6190233B1Feb 20, 2001
Method and apparatus for improving gap-fill capability using chemical and physical etchbacks
APPLIED MATERIALS INC277 citations98
US6809026B2Oct 26, 2004
Selective deposition of a barrier layer on a metal film
APPLIED MATERIALS INC92 citations97
US5990000ANov 23, 1999
Method and apparatus for improving gap-fill capability using chemical and physical etchbacks
APPLIED MATERIALS INC270 citations97