Inventor
KARASHIMA AKIRA
JP7 patents
Patents
7 patentsUS6780749B2Aug 24, 2004
Method of manufacturing a semiconductor chip comprising multiple bonding pads in staggard rows on edges
TEXAS INSTRUMENTS INC63 citations95
US5920116AJul 6, 1999
Rigidized lead frame for a semiconductor device
TEXAS INSTRUMENTS INC61 citations95
US6873059B2Mar 29, 2005
Semiconductor package with metal foil attachment film
TEXAS INSTRUMENTS INC25 citations92
US6583483B2Jun 24, 2003
Semiconductor device and its manufacturing method
TEXAS INSTRUMENTS INC18 citations92
US4870474ASep 26, 1989
Lead frame
TEXAS INSTRUMENTS INC44 citations91
US6225703B1May 1, 2001
Semiconductor device
TEXAS INSTRUMENTS INC15 citations80
US6768212B2Jul 27, 2004
Semiconductor packages and methods for manufacturing such semiconductor packages
TEXAS INSTRUMENTS INC10 citations70