Inventor
ARANA LEONEL R
US25 patents
⚠️ This page may combine multiple inventors who share the name “ARANA LEONEL R”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
INTEL CORP
17 patentsUS7402515B2Jul 22, 2008
Method of forming through-silicon vias with stress buffer collars and resulting devices
INTEL CORP375 citations98
US7592697B2Sep 22, 2009
Microelectronic package and method of cooling same
INTEL CORP64 citations95
US7144299B2Dec 5, 2006
Methods and devices for supporting substrates using fluids
INTEL CORP13 citations84
US7462551B2Dec 9, 2008
Adhesive system for supporting thin silicon wafer
INTEL CORP17 citations81
US7243833B2Jul 17, 2007
Electrically-isolated interconnects and seal rings in packages using a solder preform
INTEL CORP9 citations74
US9659899B2May 23, 2017
Die warpage control for thin die assembly
INTEL CORP2 citations70
US9472519B2Oct 18, 2016
Forming sacrificial composite materials for package-on-package architectures and structures formed thereby
INTEL CORP1 citations62
US8009442B2Aug 30, 2011
Directing the flow of underfill materials using magnetic particles
INTEL CORP6 citations62
US7224050B2May 29, 2007
Plastic materials including dendrimers or hyperbranched polymers for integrated circuit packaging
INTEL CORP3 citations62
US12345932B2Jul 1, 2025
Die last and waveguide last architecture for silicon photonic packaging
INTEL CORP0 citations61
US11721631B2Aug 8, 2023
Via structures having tapered profiles for embedded interconnect bridge substrates
INTEL CORP0 citations59
US11373951B2Jun 28, 2022
Via structures having tapered profiles for embedded interconnect bridge substrates
INTEL CORP0 citations59
US7087451B2Aug 8, 2006
Microfabricated hot wire vacuum sensor
INTEL CORP3 citations57
US9793233B2Oct 17, 2017
Forming sacrificial composite materials for package-on-package architectures and structures formed thereby
INTEL CORP0 citations51
US12560771B2Feb 24, 2026
Die first fan-out architecture for electric and optical integration
INTEL CORP0 citations50
US9808875B2Nov 7, 2017
Methods of fabricating low melting point solder reinforced sealant and structures formed thereby
INTEL CORP0 citations50
US10078204B2Sep 18, 2018
Non-destructive 3-dimensional chemical imaging of photo-resist material
INTEL CORP0 citations39
MASSACHUSETTS INST TECHNOLOGY
2 patentsXU DINGYING
2 patentsUS8287996B2Oct 16, 2012
Coating for a microelectronic device, treatment comprising same, and method of managing a thermal profile of a microelectronic die
XU DINGYING5 citations71
US8569108B2Oct 29, 2013
Coating for a microelectronic device, treatment comprising same, and method of managing a thermal profile of a microelectronic die
XU DINGYING0 citations50