Inventor
NATEKAR DEVENDRA
US14 patents
⚠️ This page may combine multiple inventors who share the name “NATEKAR DEVENDRA”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
INTEL CORP
10 patentsUS7402515B2Jul 22, 2008
Method of forming through-silicon vias with stress buffer collars and resulting devices
INTEL CORP375 citations98
US7443030B2Oct 28, 2008
Thin silicon based substrate
INTEL CORP18 citations92
US7413995B2Aug 19, 2008
Etched interposer for integrated circuit devices
INTEL CORP17 citations92
US7049208B2May 23, 2006
Method of manufacturing of thin based substrate
INTEL CORP13 citations92
US7514116B2Apr 7, 2009
Horizontal Carbon Nanotubes by Vertical Growth and Rolling
INTEL CORP9 citations84
US7144299B2Dec 5, 2006
Methods and devices for supporting substrates using fluids
INTEL CORP13 citations84
US7915081B2Mar 29, 2011
Flexible interconnect pattern on semiconductor package
INTEL CORP9 citations83
US7528006B2May 5, 2009
Integrated circuit die containing particle-filled through-silicon metal vias with reduced thermal expansion
INTEL CORP17 citations83
US7589424B2Sep 15, 2009
Thin silicon based substrate
INTEL CORP5 citations73
US7592704B2Sep 22, 2009
Etched interposer for integrated circuit devices
INTEL CORP4 citations62
TOMITA YOSHIHIRO
3 patentsUS8409924B2Apr 2, 2013
Flexible interconnect pattern on semiconductor package
TOMITA YOSHIHIRO2 citations61
US8227907B2Jul 24, 2012
Flexible interconnect pattern on semiconductor package
TOMITA YOSHIHIRO1 citations61
US8518750B2Aug 27, 2013
Flexible interconnect pattern on semiconductor package
TOMITA YOSHIHIRO0 citations50