Inventor
LIN WEN-TI
TW6 patents
⚠️ This page may combine multiple inventors who share the name “LIN WEN-TI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IND TECH RES INST
4 patentsUS7300865B2Nov 27, 2007
Method for bonding IC chips to substrates incorporating dummy bumps and non-conductive adhesive
IND TECH RES INST53 citations95
US6919642B2Jul 19, 2005
Method for bonding IC chips to substrates incorporating dummy bumps and non-conductive adhesive and structures formed
IND TECH RES INST66 citations95
US6605491B1Aug 12, 2003
Method for bonding IC chips to substrates with non-conductive adhesive
IND TECH RES INST30 citations92
US6830981B2Dec 14, 2004
Vertical nanotube transistor and process for fabricating the same
IND TECH RES INST43 citations89