Inventor
GIGNAC LYNNE MARIE
US6 patents
Patents
6 patentsUS7247946B2Jul 24, 2007
On-chip Cu interconnection using 1 to 5 nm thick metal cap
IBM35 citations91
US6448173B1Sep 10, 2002
Aluminum-based metallization exhibiting reduced electromigration and method therefor
IBM21 citations91
US6436823B1Aug 20, 2002
Method for forming a TiN layer on top of a metal silicide layer in a semiconductor structure and structure formed
IBM7 citations71
US6989282B2Jan 24, 2006
Control of liner thickness for improving thermal cycle reliability
IBM2 citations61
US12329044B2Jun 10, 2025
Applying inert ion beam etching for improving a profile and repairing sidewall damage for phase change memory devices
IBM0 citations54
US7345305B2Mar 18, 2008
Control of liner thickness for improving thermal cycle reliability
IBM0 citations51