Inventor
HOECKELE UWE
DE19 patents
⚠️ This page may combine multiple inventors who share the name “HOECKELE UWE”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
INFINEON TECHNOLOGIES AG
12 patentsUS7772123B2Aug 10, 2010
Through substrate via semiconductor components
INFINEON TECHNOLOGIES AG41 citations95
US10692921B2Jun 23, 2020
Method of manufacturing an imager and imager device
INFINEON TECHNOLOGIES AG1 citations72
US10411060B2Sep 10, 2019
Method of manufacturing an imager and imager device
INFINEON TECHNOLOGIES AG2 citations72
US9659992B2May 23, 2017
Method of manufacturing an imager and imager device
INFINEON TECHNOLOGIES AG2 citations72
US10332814B2Jun 25, 2019
Bonded system and a method for adhesively bonding a hygroscopic material
INFINEON TECHNOLOGIES AG2 citations68
US9006898B2Apr 14, 2015
Conductive lines and pads and method of manufacturing thereof
INFINEON TECHNOLOGIES AG3 citations62
US8815743B2Aug 26, 2014
Through substrate via semiconductor components and methods of formation thereof
INFINEON TECHNOLOGIES AG2 citations62
US10913656B2Feb 9, 2021
Method for sealing an access opening to a cavity and MEMS component comprising a sealing element
INFINEON TECHNOLOGIES AG0 citations51
US10854669B2Dec 1, 2020
Method of manufacturing an imager and imager device
INFINEON TECHNOLOGIES AG0 citations51
US8927419B2Jan 6, 2015
Chip comprising an integrated circuit, fabrication method and method for locally rendering a carbonic layer conductive
INFINEON TECHNOLOGIES AG0 citations51
US9728480B2Aug 8, 2017
Passivation layer and method of making a passivation layer
INFINEON TECHNOLOGIES AG1 citations45
US8999187B2Apr 7, 2015
Method for manufacturing a device on a substrate
INFINEON TECHNOLOGIES AG0 citations45