Inventor

ROPPONGI TAKAHIRO

JP24 patents

⚠️ This page may combine multiple inventors who share the name “ROPPONGI TAKAHIRO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

ROPPONGI TAKAHIRO

SENJU METAL INDUSTRY CO

Lead-free solder

Cu ball

Solder for use on surfaces coated with nickel by electroless plating

Joining member, solder material, solder paste, formed solder, flux coated material, and solder joint

Cu ball, Cu core ball, solder joint, solder paste, and solder foam

Core ball, solder paste, formed-solder, flux-coated core ball and solder joint

Cu core ball, solder paste, formed solder, Cu core column, and solder joint

Cu core ball, solder joint, solder paste and formed solder

Lead-free solder ball

Coated solder spheres and method for producing the same

Solder material, solder paste, solder preform, solder joint and method of managing the solder material

Solder material, solder paste, and solder joint

Soldering material

Core material, semiconductor package, and forming method of bump electrode

Cu core ball, solder joint, solder paste and formed solder

Method of manufacturing cu core ball

Method for producing metal ball, joining material, and metal ball

Cu column, Cu core column, solder joint, and through-silicon via

Solder material, solder joint, and method of manufacturing the solder material

Cu core ball

Ag ball, ag core ball, flux-coated ag ball, flux-coated ag core ball, solder joint, formed solder, solder paste and ag paste

Ni ball, Ni core ball, solder joint, solder paste, and solder foam

Flux composition for solder applications

SOHMA DAISUKE

Coated solder spheres and method for producing the same