Inventor
YANAGAWA TAKUMI
US14 patents
⚠️ This page may combine multiple inventors who share the name “YANAGAWA TAKUMI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
LAM RES CORP
8 patentsUS10504744B1Dec 10, 2019
Three or more states for achieving high aspect ratio dielectric etch
LAM RES CORP25 citations93
US7977390B2Jul 12, 2011
Method for plasma etching performance enhancement
LAM RES CORP29 citations92
US10741407B2Aug 11, 2020
Reduction of sidewall notching for high aspect ratio 3D NAND etch
LAM RES CORP8 citations78
US10861708B2Dec 8, 2020
Three or more states for achieving high aspect ratio dielectric etch
LAM RES CORP4 citations72
US10847377B2Nov 24, 2020
Method of achieving high selectivity for high aspect ratio dielectric etch
LAM RES CORP2 citations71
US10515821B1Dec 24, 2019
Method of achieving high selectivity for high aspect ratio dielectric etch
LAM RES CORP3 citations71
US12505991B2Dec 23, 2025
Tunability of edge plasma density for tilt control
LAM RES CORP0 citations56
US12020944B2Jun 25, 2024
Method for etching an etch layer
LAM RES CORP0 citations50
IBM
5 patentsUS10621284B2Apr 14, 2020
Training data update
IBM1 citations71
US10614269B2Apr 7, 2020
Training data update
IBM1 citations71
US10387572B2Aug 20, 2019
Training data update
IBM1 citations71
US10372826B2Aug 6, 2019
Training data update
IBM1 citations71
US11687808B2Jun 27, 2023
Artificial intelligence explaining for natural language processing
IBM2 citations69