Inventor

AMAGO HIROHISA

JP6 patents

⚠️ This page may combine multiple inventors who share the name “AMAGO HIROHISA”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SONY CORP

2 patents

US5402314AMar 28, 1995

Printed circuit board having through-hole stopped with photo-curable solder resist

SONY CORP63 citations92

US11993094B2May 28, 2024

Reversible recording medium and exterior member

SONY CORP0 citations61

SONY GROUP CORP

2 patents

US12145388B2Nov 19, 2024

Recording medium and exterior member

SONY GROUP CORP0 citations61

US12403711B2Sep 2, 2025

Laminate, card, and housing

SONY GROUP CORP0 citations43

UMEZU NOBUHIKO

1 patent

US8193008B2Jun 5, 2012

Method of forming semiconductor thin film and semiconductor thin film inspection apparatus

UMEZU NOBUHIKO4 citations58

AMAGO HIROHISA

1 patent

US8404498B2Mar 26, 2013

Method of inspecting semiconductor thin film by transmission imaging and inspection device for the same

AMAGO HIROHISA2 citations54