P

Inventor

ISHIKAWA TETSUJI

JP10 patents
⚠️ This page may combine multiple inventors who share the name “ISHIKAWA TETSUJI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

FUJITSU LTD

4 patents
US7469457B2Dec 30, 2008

Method of removing integrated circuit chip package and detachment jig therefor

FUJITSU LTD17 citations82
US7661573B2Feb 16, 2010

Heating apparatus

FUJITSU LTD5 citations56
US10989743B2Apr 27, 2021

Power-demand-value calculating system, power-demand-value calculating method, and recording medium recording power-demand-value calculating program

FUJITSU LTD0 citations51
US7975898B2Jul 12, 2011

Joining method and reflow apparatus

FUJITSU LTD1 citations50

SONY CHEMICALS CORP

3 patents
US6033508AMar 7, 2000

Method and apparatus for manufacturing ribbon roll

SONY CHEMICALS CORP4 citations56
US6972066B2Dec 6, 2005

Roll, roll production apparatus and method for producing roll

SONY CHEMICALS CORP5 citations53
USD515128SFeb 14, 2006

Bobbin for heat transfer printing film

SONY CHEMICALS CORP0 citations51

TAMURA KAKEN CO LTD

2 patents
US5853957ADec 29, 1998

Photosensitive resin compositions, cured films thereof, and circuit boards

TAMURA KAKEN CO LTD10 citations69
US6156462ADec 5, 2000

Photosensitive resin compositions, cured films thereof, and circuit substrates

TAMURA KAKEN CO LTD2 citations58

ISHIKAWA TETSUJI

1 patent
US8434658B2May 7, 2013

Joining method and reflow apparatus

ISHIKAWA TETSUJI3 citations55