Inventor
HAYDEN III JOSEPH S
US3 patents
Patents
3 patentsUS7368808B2May 6, 2008
MEMS packaging using a non-silicon substrate for encapsulation and interconnection
INTEL CORP60 citations94
US7170155B2Jan 30, 2007
MEMS RF switch module including a vertical via
INTEL CORP27 citations89
US7324350B2Jan 29, 2008
MEMS RF switch module including a vertical via
INTEL CORP13 citations80