Inventor
ENDO TOSHIKAZU
JP18 patents
⚠️ This page may combine multiple inventors who share the name “ENDO TOSHIKAZU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TDK CORP
10 patentsUS6713162B2Mar 30, 2004
Electronic parts
TDK CORP151 citations98
US7060350B2Jun 13, 2006
Composite magnetic material and magnetic molding material, magnetic powder compression molding material, and magnetic paint using the composite magnetic material, composite dielectric material and molding material, powder compression molding material, paint, prepreg, and substrate using the composite dielectric material, and electronic part
TDK CORP75 citations97
US6808642B2Oct 26, 2004
Method for producing multilayer substrate and electronic part, and multilayer electronic part
TDK CORP62 citations96
US6908960B2Jun 21, 2005
Composite dielectric material, composite dielectric substrate, prepreg, coated metal foil, molded sheet, composite magnetic substrate, substrate, double side metal foil-clad substrate, flame retardant substrate, polyvinylbenzyl ether resin composition, thermosettin
TDK CORP58 citations94
US7081803B2Jul 25, 2006
Inductance element, laminated electronic component, laminated electronic component module and method for producing these element, component and module
TDK CORP41 citations92
US7733600B2Jun 8, 2010
Hard disk drive and wireless data terminal using the same
TDK CORP10 citations84
US7547975B2Jun 16, 2009
Module with embedded semiconductor IC and method of fabricating the module
TDK CORP14 citations84
US6749928B2Jun 15, 2004
Electronic parts and method producing the same
TDK CORP18 citations84
US7167071B2Jan 23, 2007
Inductive device and method for producing the same
TDK CORP5 citations62
US7812444B2Oct 12, 2010
Semiconductor IC-embedded module with multilayer substrates with multiple chips embedded therein
TDK CORP0 citations51