Inventor

BAEK JOONG-HYUN

KR28 patents

⚠️ This page may combine multiple inventors who share the name “BAEK JOONG-HYUN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

BAEK JOONG-HYUN

SAMSUNG ELECTRONICS CO LTD

Stacked semiconductor module and method of manufacturing the same

Semiconductor module with vertically mounted semiconductor chip packages

Heat sink with cooling fins for semiconductor package

Semiconductor module with heat sink and method thereof

Semiconductor chip package with thermoelectric cooler

Semiconductor package having thermal interface material (TIM)

Integrated circuit package and integrated circuit module

Semiconductor device including thermally dissipating dummy pads

Underfill system for semiconductor package

Multi-chip package having improved heat spread characteristics and method for manufacturing the same

Wafer stacked package waving bertical heat emission path and method of fabricating the same

Wafer stacked package having vertical heat emission path and method of fabricating the same

Semiconductor module with improved solder joint reliability

Mold having projections for inhibiting the formation of air pockets

Semiconductor stack package and memory module with improved heat dissipation

Vertical semiconductor device package having printed circuit board and heat spreader, and module having the packages

Light emitting device

Semiconductor memory module having an oblique memory chip

Cooling apparatus for memory module

Memory module, socket and mounting method providing improved heat dissipating characteristics

Semiconductor package having thermal interface material (TIM)

BAEK JOONG-HYUN

Semiconductor module

Wafer stacked package waving bertical heat emission path and method of fabricating the same

Semiconductor module and an electronic system including the same

KIM JAE-YOUNG

Apparatus for amplifying nucleic acids

PARK CHUL

Integrated circuit packages having redistribution structures

LEE HEE-JIN

Method of manufacturing semiconductor package

KIM YONG-HOON

Package on package having improved thermal characteristics