Inventor
SABDE GUNDU M
US32 patents
⚠️ This page may combine multiple inventors who share the name “SABDE GUNDU M”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
MICRON TECHNOLOGY INC
31 patentsUS6358122B1Mar 19, 2002
Method and apparatus for mechanical and chemical-mechanical planarization of microelectronic substrates with metal compound abrasives
MICRON TECHNOLOGY INC131 citations99
US6331135B1Dec 18, 2001
Method and apparatus for mechanical and chemical-mechanical planarization of microelectronic substrates with metal compound abrasives
MICRON TECHNOLOGY INC101 citations99
US6306012B1Oct 23, 2001
Methods and apparatuses for planarizing microelectronic substrate assemblies
MICRON TECHNOLOGY INC124 citations99
US6376381B1Apr 23, 2002
Planarizing solutions, planarizing machines, and methods for mechanical and/or chemical-mechanical planarization of microelectronic substrate assemblies
MICRON TECHNOLOGY INC138 citations98
US6533893B2Mar 18, 2003
Method and apparatus for chemical-mechanical planarization of microelectronic substrates with selected planarizing liquids
MICRON TECHNOLOGY INC72 citations96
US6492273B1Dec 10, 2002
Methods and apparatuses for monitoring and controlling mechanical or chemical-mechanical planarization of microelectronic substrate assemblies
MICRON TECHNOLOGY INC51 citations96
US6468912B2Oct 22, 2002
Methods and apparatuses for monitoring and controlling mechanical or chemical-mechanical planarization of microelectronic substrate assemblies
MICRON TECHNOLOGY INC26 citations96
US6461964B2Oct 8, 2002
Methods and apparatuses for monitoring and controlling mechanical or chemical-mechanical planarization of microelectronic substrate assemblies
MICRON TECHNOLOGY INC28 citations96
US6383934B1May 7, 2002
Method and apparatus for chemical-mechanical planarization of microelectronic substrates with selected planarizing liquids
MICRON TECHNOLOGY INC73 citations96
US6464824B1Oct 15, 2002
Methods and apparatuses for monitoring and controlling mechanical or chemical-mechanical planarization of microelectronic substrate assemblies
MICRON TECHNOLOGY INC49 citations94
US7625495B2Dec 1, 2009
Methods and apparatuses for monitoring and controlling mechanical or chemical-mechanical planarization of microelectronic substrate assemblies
MICRON TECHNOLOGY INC8 citations92
US6699791B2Mar 2, 2004
Methods and apparatuses for monitoring and controlling mechanical or chemical-mechanical planarization of microelectronic substrate assemblies
MICRON TECHNOLOGY INC19 citations92
US6472325B2Oct 29, 2002
Method and apparatuses for monitoring and controlling mechanical or chemical-mechanical planarization of microelectronic substrate assemblies
MICRON TECHNOLOGY INC23 citations92
US7121926B2Oct 17, 2006
Methods for planarization of group VIII metal-containing surfaces using a fixed abrasive article
MICRON TECHNOLOGY INC19 citations84
US7261832B2Aug 28, 2007
Methods and apparatuses for monitoring and controlling mechanical or chemical-mechanical planarization of microelectronic substrate assemblies
MICRON TECHNOLOGY INC3 citations74
US6858538B2Feb 22, 2005
Methods and apparatuses for monitoring and controlling mechanical or chemical-mechanical planarization of microelectronic substrate assemblies
MICRON TECHNOLOGY INC5 citations74
US6720266B2Apr 13, 2004
Methods and apparatuses for monitoring and controlling mechanical or chemical-mechanical planarization of microelectronic substrate assemblies
MICRON TECHNOLOGY INC6 citations74
US6589101B2Jul 8, 2003
Method and apparatus for mechanical and chemical-mechanical planarization of microelectronic substrates with metal compound abrasives
MICRON TECHNOLOGY INC8 citations74
US6485356B2Nov 26, 2002
Method and apparatus for mechanical and chemical-mechanical planarization of microelectronic substrates with metal compound abrasives
MICRON TECHNOLOGY INC4 citations74
US7566391B2Jul 28, 2009
Methods and systems for removing materials from microfeature workpieces with organic and/or non-aqueous electrolytic media
MICRON TECHNOLOGY INC4 citations63
US6682628B2Jan 27, 2004
Methods and apparatuses for monitoring and controlling mechanical or chemical-mechanical planarization of microelectronic substrate assemblies
MICRON TECHNOLOGY INC4 citations59
US7988529B2Aug 2, 2011
Methods and tools for controlling the removal of material from microfeature workpieces
MICRON TECHNOLOGY INC2 citations57
US8603319B2Dec 10, 2013
Methods and systems for removing materials from microfeature workpieces with organic and/or non-aqueous electrolytic media
MICRON TECHNOLOGY INC0 citations52
US7138072B2Nov 21, 2006
Methods and apparatuses for planarizing microelectronic substrate assemblies
MICRON TECHNOLOGY INC0 citations52
US7083700B2Aug 1, 2006
Methods and apparatuses for planarizing microelectronic substrate assemblies
MICRON TECHNOLOGY INC0 citations52
US6903018B2Jun 7, 2005
Methods and apparatuses for planarizing microelectronic substrate assemblies
MICRON TECHNOLOGY INC0 citations52
US6881127B2Apr 19, 2005
Method and apparatuses for planarizing microelectronic substrate assemblies
MICRON TECHNOLOGY INC0 citations52
US6595833B2Jul 22, 2003
Method and apparatus for mechanical and chemical-mechanical planarization of microelectronic substrates with metal compound abrasives
MICRON TECHNOLOGY INC0 citations52
US6416401B1Jul 9, 2002
Method and apparatus for mechanical and chemical-mechanical planarization of microelectronic substrates with metal compound abrasives
MICRON TECHNOLOGY INC0 citations52
US8969217B2Mar 3, 2015
Methods of treating semiconductor substrates, methods of forming openings during semiconductor fabrication, and methods of removing particles from over semiconductor substrates
MICRON TECHNOLOGY INC0 citations49
US7527545B2May 5, 2009
Methods and tools for controlling the removal of material from microfeature workpieces
MICRON TECHNOLOGY INC0 citations46