Inventor
PARIKH SUKETU A
US16 patents
Patents
16 patentsUS6225207B1May 1, 2001
Techniques for triple and quadruple damascene fabrication
APPLIED MATERIALS INC111 citations97
US6127263AOct 3, 2000
Misalignment tolerant techniques for dual damascene fabrication
APPLIED MATERIALS INC93 citations97
US6940170B2Sep 6, 2005
Techniques for triple and quadruple damascene fabrication
APPLIED MATERIALS INC50 citations95
US6656840B2Dec 2, 2003
Method for forming silicon containing layers on a substrate
APPLIED MATERIALS INC54 citations93
US7205228B2Apr 17, 2007
Selective metal encapsulation schemes
APPLIED MATERIALS INC40 citations92
US6514671B1Feb 4, 2003
Interconnect line formed by dual damascene using dielectric layers having dissimilar etching characteristics
APPLIED MATERIALS INC39 citations92
US6391771B1May 21, 2002
Integrated circuit interconnect lines having sidewall layers
APPLIED MATERIALS INC26 citations92
US8005634B2Aug 23, 2011
Copper wiring module control
APPLIED MATERIALS INC11 citations84
US6594540B1Jul 15, 2003
Misalignment tolerant techniques for dual damascene fabrication
APPLIED MATERIALS INC15 citations83
US11075165B2Jul 27, 2021
Methods and apparatus for forming dual metal interconnects
APPLIED MATERIALS INC2 citations69
US10892198B2Jan 12, 2021
Systems and methods for improved performance in semiconductor processing
APPLIED MATERIALS INC4 citations66
US7572734B2Aug 11, 2009
Etch depth control for dual damascene fabrication process
APPLIED MATERIALS INC2 citations63
US11049770B2Jun 29, 2021
Methods and apparatus for fabrication of self aligning interconnect structure
APPLIED MATERIALS INC1 citations62
US10867858B2Dec 15, 2020
Simultaneous metal patterning for 3D interconnects
APPLIED MATERIALS INC1 citations62
US11948885B2Apr 2, 2024
Methods and apparatus for forming dual metal interconnects
APPLIED MATERIALS INC0 citations59
US9437479B2Sep 6, 2016
Methods for forming an interconnect pattern on a substrate
APPLIED MATERIALS INC1 citations52