Inventor
TERANISHI SHUNSUKE
JP19 patents
⚠️ This page may combine multiple inventors who share the name “TERANISHI SHUNSUKE”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
DISCO CORP
17 patentsUS12383982B2Aug 12, 2025
Laminated device wafer forming method
DISCO CORP1 citations61
US12593638B2Mar 31, 2026
Device wafer processing method
DISCO CORP0 citations51
US12512314B2Dec 30, 2025
Processing method of wafer
DISCO CORP0 citations50
US12424456B2Sep 23, 2025
Method of manufacturing package device
DISCO CORP0 citations50
US12354995B2Jul 8, 2025
Laminated device chip manufacturing method
DISCO CORP0 citations50
US12304109B2May 20, 2025
Method of separating wafer
DISCO CORP0 citations50
US12300545B2May 13, 2025
Wafer manufacturing method and laminated device chip manufacturing method
DISCO CORP0 citations50
US12198990B2Jan 14, 2025
Wafer manufacturing method and laminated device chip manufacturing method
DISCO CORP0 citations50
US12170224B2Dec 17, 2024
Method of processing wafer
DISCO CORP0 citations50
US11854891B2Dec 26, 2023
Wafer manufacturing method and laminated device chip manufacturing method
DISCO CORP0 citations50
US11764114B2Sep 19, 2023
Wafer manufacturing method and laminated device chip manufacturing method
DISCO CORP0 citations50
US11764115B2Sep 19, 2023
Wafer manufacturing method and laminated device chip manufacturing method
DISCO CORP0 citations50
US11756831B2Sep 12, 2023
Wafer manufacturing method and laminated device chip manufacturing method
DISCO CORP0 citations50
US12322655B2Jun 3, 2025
Method of manufacturing layered device chip assembly
DISCO CORP0 citations49
US11456260B2Sep 27, 2022
Wafer processing method
DISCO CORP0 citations48
US11417570B2Aug 16, 2022
Wafer processing method
DISCO CORP0 citations48
US10249547B2Apr 2, 2019
Method for using a test wafer by forming modified layer using a laser beam and observing damage after forming modified layer
DISCO CORP0 citations33