Inventor

CHENG PAI-SHENG

TW9 patents

⚠️ This page may combine multiple inventors who share the name “CHENG PAI-SHENG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

HIMAX TECH LTD

3 patents

US7906374B2Mar 15, 2011

COF packaging structure, method of manufacturing the COF packaging structure, and method for assembling a driver IC and the COF packaging structure thereof

HIMAX TECH LTD3 citations60

US7473459B2Jan 6, 2009

Method of manufacturing a film printed circuit board

HIMAX TECH LTD2 citations57

US10777525B1Sep 15, 2020

Filp chip package

HIMAX TECH LTD0 citations30

HIMAX TECH INC

2 patents

US7064449B2Jun 20, 2006

Bonding pad and chip structure

HIMAX TECH INC41 citations91

US7061078B2Jun 13, 2006

Semiconductor package

HIMAX TECH INC13 citations81

CHIPBOND TECHNOLOGY CORP

2 patents

US12543581B2Feb 3, 2026

Flip-chip bonding structure and substrate thereof

CHIPBOND TECHNOLOGY CORP0 citations48

US12317462B2May 27, 2025

Electronic package and method of manufacturing the same

CHIPBOND TECHNOLOGY CORP0 citations47

ADVANCED SEMICONDUCTOR ENG

1 patent

US9105613B1Aug 11, 2015

Method of manufacturing electronic package module and electronic package module manufactured by the same

ADVANCED SEMICONDUCTOR ENG23 citations89

CHENG PAI-SHENG

1 patent

US8674503B2Mar 18, 2014

Circuit board, fabricating method thereof and package structure

CHENG PAI-SHENG0 citations43