Inventor
CHANG CHE-LUN
TW21 patents
⚠️ This page may combine multiple inventors who share the name “CHANG CHE-LUN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TAIWAN SEMICONDUCTOR MFG CO LTD
19 patentsUS11935781B2Mar 19, 2024
Integrated circuit structure with backside dielectric layer having air gap
TAIWAN SEMICONDUCTOR MFG CO LTD5 citations86
US11437245B2Sep 6, 2022
Germanium hump reduction
TAIWAN SEMICONDUCTOR MFG CO LTD5 citations81
US11450559B2Sep 20, 2022
Integrated circuit structure with backside dielectric layer having air gap
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US11417767B2Aug 16, 2022
Semiconductor devices including backside vias and methods of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US11316030B2Apr 26, 2022
Fin field-effect transistor device and method
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations71
US12581704B2Mar 17, 2026
Semiconductor device structure and method for forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12310057B2May 20, 2025
Semiconductor devices including backside vias and methods of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12308287B2May 20, 2025
Integrated circuit structure with backside dielectric layer having air gap
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12255102B2Mar 18, 2025
Methods of forming of inner spacer structure using semiconductor material with variable germanium concentration
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12131911B2Oct 29, 2024
CMP process and methods thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12040407B2Jul 16, 2024
Semiconductor devices including backside vias and methods of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations62
US11862709B2Jan 2, 2024
Inner spacer structure and methods of forming such
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations62
US11616133B2Mar 28, 2023
Fin field-effect transistor device and method
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations61
US12014919B2Jun 18, 2024
Dielectric layer, interconnection structure using the same, and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations59
US11854819B2Dec 26, 2023
Germanium hump reduction
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations59
US11387109B1Jul 12, 2022
CMP process and methods thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations59
US10950426B2Mar 16, 2021
Dielectric layer, interconnection structure using the same, and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations59
US12538532B2Jan 27, 2026
Method of forming a gap under a source/drain feature of a multi-gate device
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US12453127B2Oct 21, 2025
Methods of manufacturing semiconductor devices and semiconductor devices
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52