Inventor
HIKAWA TETSUO
JP19 patents
⚠️ This page may combine multiple inventors who share the name “HIKAWA TETSUO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
MEGA CHIPS CORP
17 patentsUS5738731AApr 14, 1998
Photovoltaic device
MEGA CHIPS CORP236 citations99
US6225668B1May 1, 2001
Semiconductor device having a single crystal gate electrode and insulation
MEGA CHIPS CORP39 citations96
US6177706B1Jan 23, 2001
Field-effect thin-film transistor device
MEGA CHIPS CORP47 citations96
US6137120AOct 24, 2000
Semiconductor device and method of fabricating the same
MEGA CHIPS CORP28 citations96
US6025252AFeb 15, 2000
Semiconductor device and method of fabricating the same
MEGA CHIPS CORP49 citations96
US6677214B1Jan 13, 2004
Semiconductor device and method of fabricating the same
MEGA CHIPS CORP29 citations92
US6106734AAug 22, 2000
Micromachine manufacture using gas beam crystallization
MEGA CHIPS CORP16 citations92
US5666304ASep 9, 1997
Semiconductor memory device and method of fabricating the same
MEGA CHIPS CORP19 citations92
US5895887AApr 20, 1999
Semiconductor device
MEGA CHIPS CORP13 citations82
US5825083AOct 20, 1998
Semiconductor device
MEGA CHIPS CORP13 citations82
US5526306AJun 11, 1996
Semiconductor memory device and method of fabricating the same
MEGA CHIPS CORP18 citations82
US5866940AFeb 2, 1999
Semiconductor device
MEGA CHIPS CORP8 citations74
US5847449ADec 8, 1998
Semiconductor device
MEGA CHIPS CORP4 citations74
US5753553AMay 19, 1998
Method of fabricating ROMs by selectively forming sidewalls on wordlines
MEGA CHIPS CORP11 citations74
US5700975ADec 23, 1997
Semiconductor device
MEGA CHIPS CORP10 citations74
US5563844AOct 8, 1996
Architecture for accessing very high density memory device
MEGA CHIPS CORP7 citations74
US5640367AJun 17, 1997
Semiconductor memory device and method of fabricating the same
MEGA CHIPS CORP0 citations52