Inventor
RATHORE HAZARA S
US22 patents
⚠️ This page may combine multiple inventors who share the name “RATHORE HAZARA S”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
21 patentsUS7397260B2Jul 8, 2008
Structure and method for monitoring stress-induced degradation of conductive interconnects
IBM169 citations98
US6130161AOct 10, 2000
Method of forming copper interconnections with enhanced electromigration resistance and reduced defect sensitivity
IBM111 citations98
US6069068AMay 30, 2000
Sub-quarter-micron copper interconnections with improved electromigration resistance and reduced defect sensitivity
IBM224 citations98
US6033939AMar 7, 2000
Method for providing electrically fusible links in copper interconnection
IBM152 citations98
US6133139AOct 17, 2000
Self-aligned composite insulator with sub-half-micron multilevel high density electrical interconnections and process thereof
IBM51 citations96
US6348731B1Feb 19, 2002
Copper interconnections with enhanced electromigration resistance and reduced defect sensitivity and method of forming same
IBM77 citations95
US6287954B1Sep 11, 2001
Method of forming copper interconnections with enhanced electromigration resistance and reduced defect sensitivity
IBM71 citations95
US7224063B2May 29, 2007
Dual-damascene metallization interconnection
IBM30 citations92
US6294835B1Sep 25, 2001
Self-aligned composite insulator with sub-half-micron multilevel high density electrical interconnections and process thereof
IBM26 citations92
US6258710B1Jul 10, 2001
Sub-quarter-micron copper interconnections with improved electromigration resistance and reduced defect sensitivity
IBM39 citations92
US5981374ANov 9, 1999
Sub-half-micron multi-level interconnection structure and process thereof
IBM37 citations92
US5252516AOct 12, 1993
Method for producing interlevel stud vias
IBM26 citations92
US6069051AMay 30, 2000
Method of producing planar metal-to-metal capacitor for use in integrated circuits
IBM34 citations91
US6972209B2Dec 6, 2005
Stacked via-stud with improved reliability in copper metallurgy
IBM32 citations90
US5434451AJul 18, 1995
Tungsten liner process for simultaneous formation of integral contact studs and interconnect lines
IBM44 citations89
US6825561B1Nov 30, 2004
Structure and method for eliminating time dependent dielectric breakdown failure of low-k material
IBM15 citations84
US7470613B2Dec 30, 2008
Dual damascene multi-level metallization
IBM7 citations73
US7138714B2Nov 21, 2006
Via barrier layers continuous with metal line barrier layers at notched or dielectric mesa portions in metal lines
IBM10 citations73
US8053257B2Nov 8, 2011
Method for prediction of premature dielectric breakdown in a semiconductor
IBM5 citations62
US7639032B2Dec 29, 2009
Structure for monitoring stress-induced degradation of conductive interconnects
IBM2 citations62
US7692439B2Apr 6, 2010
Structure for modeling stress-induced degradation of conductive interconnects
IBM0 citations51