P

Inventor

LIN CHIA-HUEI

TW40 patents
⚠️ This page may combine multiple inventors who share the name “LIN CHIA-HUEI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

UNITED MICROELECTRONICS CORP

36 patents
US10460980B2Oct 29, 2019

Semiconductor device comprising a deep trench isolation structure and a trap rich isolation structure in a substrate and a method of making the same

UNITED MICROELECTRONICS CORP17 citations94
US11205605B2Dec 21, 2021

Semiconductor structure with back gate and method of fabricating the same

UNITED MICROELECTRONICS CORP5 citations84
US11205609B2Dec 21, 2021

Semiconductor structure with an air gap

UNITED MICROELECTRONICS CORP7 citations83
US7737479B2Jun 15, 2010

Image sensor

UNITED MICROELECTRONICS CORP15 citations82
US7547573B2Jun 16, 2009

Image sensor and method of manufacturing the same

UNITED MICROELECTRONICS CORP15 citations82
US11133270B1Sep 28, 2021

Integrated circuit device and fabrication method thereof

UNITED MICROELECTRONICS CORP2 citations73
US11127700B1Sep 21, 2021

Integrated circuit device

UNITED MICROELECTRONICS CORP4 citations73
US7524592B2Apr 28, 2009

Optical proximity correction mask and method of fabricating color filter

UNITED MICROELECTRONICS CORP7 citations73
US9499399B2Nov 22, 2016

Method for forming MEMS structure with an etch stop layer buried within inter-dielectric layer

UNITED MICROELECTRONICS CORP4 citations72
US12249545B2Mar 11, 2025

Integrated circuit device

UNITED MICROELECTRONICS CORP0 citations62
US12132011B2Oct 29, 2024

Integrated circuit device and fabrication method thereof

UNITED MICROELECTRONICS CORP0 citations62
US12087712B2Sep 10, 2024

Method for fabricating an integrated circuit device

UNITED MICROELECTRONICS CORP0 citations62
US11848253B2Dec 19, 2023

Semiconductor structure with an air gap

UNITED MICROELECTRONICS CORP0 citations62
US11721757B2Aug 8, 2023

Semiconductor device

UNITED MICROELECTRONICS CORP0 citations62
US11658118B2May 23, 2023

Transistor structure in low noise amplifier

UNITED MICROELECTRONICS CORP0 citations62
US11658087B2May 23, 2023

High resistivity wafer with heat dissipation structure and method of making the same

UNITED MICROELECTRONICS CORP0 citations62
US11652017B2May 16, 2023

High resistivity wafer with heat dissipation structure and method of making the same

UNITED MICROELECTRONICS CORP0 citations62
US11637080B2Apr 25, 2023

Method for fabricating an integrated circuit device

UNITED MICROELECTRONICS CORP0 citations62
US11521891B2Dec 6, 2022

Semiconductor device comprising a deep trench isolation structure and a trap rich isolation structure in a substrate and a method of making the same

UNITED MICROELECTRONICS CORP0 citations62
US11476192B2Oct 18, 2022

Transistor structure in low noise amplifier

UNITED MICROELECTRONICS CORP0 citations62
US11462489B2Oct 4, 2022

Integrated circuit device and fabrication method thereof

UNITED MICROELECTRONICS CORP0 citations62
US11201115B2Dec 14, 2021

Semiconductor device

UNITED MICROELECTRONICS CORP0 citations62
US11114562B2Sep 7, 2021

Semiconductor device

UNITED MICROELECTRONICS CORP1 citations62
US11101165B2Aug 24, 2021

Method for fabricating semiconductor device comprising a deep trench isolation structure and a trap rich isolation structure in a substrate

UNITED MICROELECTRONICS CORP0 citations62
US10347712B1Jul 9, 2019

Semiconductor device and method for fabricating the same

UNITED MICROELECTRONICS CORP1 citations62
US7736939B2Jun 15, 2010

Method for forming microlenses of different curvatures and fabricating process of solid-state image sensor

UNITED MICROELECTRONICS CORP6 citations62
US7214998B2May 8, 2007

Complementary metal oxide semiconductor image sensor layout structure

UNITED MICROELECTRONICS CORP6 citations62
US10927000B2Feb 23, 2021

MEMS structure with an etch stop layer buried within inter-dielectric layer

UNITED MICROELECTRONICS CORP0 citations61
US8981501B2Mar 17, 2015

Semiconductor device and method of forming the same

UNITED MICROELECTRONICS CORP2 citations60
US12532734B2Jan 20, 2026

Semiconductor device and method of fabricating the same

UNITED MICROELECTRONICS CORP0 citations59
US12382702B2Aug 5, 2025

Semiconductor device

UNITED MICROELECTRONICS CORP0 citations56
US11894439B2Feb 6, 2024

Semiconductor device

UNITED MICROELECTRONICS CORP0 citations56
US12131976B2Oct 29, 2024

Semiconductor structure with heat dissipation structure and method of fabricating the same

UNITED MICROELECTRONICS CORP0 citations52
US10854529B2Dec 1, 2020

High resistivity wafer with heat dissipation structure and method of making the same

UNITED MICROELECTRONICS CORP0 citations52
US10679944B2Jun 9, 2020

Semiconductor structure with high resistivity wafer and fabricating method of bonding the same

UNITED MICROELECTRONICS CORP0 citations52
US10600734B2Mar 24, 2020

Transistor structure in low noise amplifier

UNITED MICROELECTRONICS CORP0 citations52

SHENZHEN TREASURE CITY TECHNOLOGY CO LTD

1 patent

AVISION INC

1 patent

LIN CHIA-HUEI

1 patent

CHEN KU-MING

1 patent