P

Inventor

KATO JURI

JP36 patents
⚠️ This page may combine multiple inventors who share the name “KATO JURI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SEIKO EPSON CORP

31 patents
US7906813B2Mar 15, 2011

Semiconductor device having a first circuit block isolating a plurality of circuit blocks

SEIKO EPSON CORP110 citations98
US5641983AJun 24, 1997

Semiconductor device having a gate electrode having a low dopant concentration

SEIKO EPSON CORP33 citations92
US5229334AJul 20, 1993

Method of forming a gate insulating film involving a step of cleaning using an ammonia-peroxide solution

SEIKO EPSON CORP37 citations92
US5312772AMay 17, 1994

Method of manufacturing interconnect metallization comprising metal nitride and silicide

SEIKO EPSON CORP35 citations90
US4998157AMar 5, 1991

Ohmic contact to silicon substrate

SEIKO EPSON CORP23 citations90
US7830215B2Nov 9, 2010

Piezoelectric oscillator and method for manufacturing the same

SEIKO EPSON CORP12 citations84
US5654209AAug 5, 1997

Method of making N-type semiconductor region by implantation

SEIKO EPSON CORP19 citations84
US5298860AMar 29, 1994

Method of analyzing metal impurities in surface oxide film of semiconductor substrate

SEIKO EPSON CORP15 citations74
US4669176AJun 2, 1987

Method for diffusing a semiconductor substrate through a metal silicide layer by rapid heating

SEIKO EPSON CORP17 citations74
US10393688B2Aug 27, 2019

Sensor device

SEIKO EPSON CORP3 citations72
US7863669B2Jan 4, 2011

Nonvolatile semiconductor memory device

SEIKO EPSON CORP2 citations63
US7638845B2Dec 29, 2009

Semiconductor device with buried conductive layer

SEIKO EPSON CORP4 citations63
US7563665B2Jul 21, 2009

Semiconductor device and method for manufacturing semiconductor device

SEIKO EPSON CORP4 citations63
US7368340B2May 6, 2008

Semiconductor device and method of making semiconductor devices

SEIKO EPSON CORP2 citations63
US7351616B2Apr 1, 2008

Semiconductor substrate, semiconductor device, method for manufacturing semiconductor substrate and method for manufacturing semiconductor device

SEIKO EPSON CORP3 citations63
US7344997B2Mar 18, 2008

Semiconductor substrate, semiconductor device, method for manufacturing semiconductor substrate and method for manufacturing semiconductor device

SEIKO EPSON CORP2 citations63
US7332399B2Feb 19, 2008

Method for manufacturing a semiconductor substrate and method for manufacturing a semiconductor in which film thicknesses can be accurately controlled

SEIKO EPSON CORP6 citations63
US7227264B2Jun 5, 2007

Semiconductor device and method for manufacturing semiconductor device

SEIKO EPSON CORP5 citations63
US6156592ADec 5, 2000

Method of manufacturing a semiconductor device containing CMOS elements

SEIKO EPSON CORP3 citations63
US5879979AMar 9, 1999

Method of manufacturing a semiconductor device containing CMOS elements

SEIKO EPSON CORP2 citations63
US4800417AJan 24, 1989

Improved semiconductor device having a polycrystalline isolation region

SEIKO EPSON CORP4 citations63
US9297741B2Mar 29, 2016

Corrosion detection sensor device

SEIKO EPSON CORP2 citations62
US7666795B2Feb 23, 2010

Method for manufacturing semiconductor device

SEIKO EPSON CORP5 citations62
US7271447B2Sep 18, 2007

Semiconductor device

SEIKO EPSON CORP5 citations62
US7956414B2Jun 7, 2011

Semiconductor substrate, semiconductor device, method for manufacturing semiconductor substrate, and method for manufacturing semiconductor device

SEIKO EPSON CORP0 citations52
US7687866B2Mar 30, 2010

Semiconductor device and method of manufacturing semiconductor device

SEIKO EPSON CORP0 citations52
US7622359B2Nov 24, 2009

Method for manufacturing semiconductor device

SEIKO EPSON CORP0 citations52
US7491609B2Feb 17, 2009

Semiconductor device and method for manufacturing the same

SEIKO EPSON CORP1 citations52
US7425484B2Sep 16, 2008

Method of manufacturing semiconductor device

SEIKO EPSON CORP1 citations52
US7898016B2Mar 1, 2011

CMOS semiconductor non-volatile memory device

SEIKO EPSON CORP0 citations42
US8017505B2Sep 13, 2011

Method for manufacturing a semiconductor device

SEIKO EPSON CORP0 citations33

KATO JURI

3 patents

SIEKO EPSON CORP

1 patent

MIYAZAWA TAKAO

1 patent