Inventor
KITAJO SAKAE
JP29 patents
⚠️ This page may combine multiple inventors who share the name “KITAJO SAKAE”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
NEC CORP
18 patentsUS6998704B2Feb 14, 2006
Semiconductor device and method for manufacturing the same, circuit board, electronic apparatus, and semiconductor device manufacturing apparatus
NEC CORP86 citations97
US6611057B2Aug 26, 2003
Semiconductor device attaining both high speed processing and sufficient cooling capacity
NEC CORP136 citations97
US6477284B1Nov 5, 2002
Photo-electric combined substrate, optical waveguide and manufacturing process therefor
NEC CORP61 citations96
US7420807B2Sep 2, 2008
Cooling device for electronic apparatus
NEC CORP36 citations92
US7230328B2Jun 12, 2007
Semiconductor package and laminated semiconductor package
NEC CORP22 citations92
US6934429B2Aug 23, 2005
Optical waveguide board and optical module
NEC CORP23 citations92
US6670699B2Dec 30, 2003
Semiconductor device packaging structure
NEC CORP48 citations92
US6438504B2Aug 20, 2002
Method of calculating thermal resistance in semiconductor package accommodating semiconductor chip within a case which can be applied to calculation for semiconductor package with radiation fins
NEC CORP21 citations92
US6238086B1May 29, 2001
Method of calculating thermal resistance in semiconductor package accommodating semiconductor chip within a case which can be applied to calculation for semiconductor package with radiation fins
NEC CORP16 citations92
US5838066ANov 17, 1998
Miniaturized cooling fan type heatsink for a semiconductior device
NEC CORP36 citations92
US7564164B2Jul 21, 2009
Drive circuit for piezoelectric pump and cooling system that uses this drive circuit
NEC CORP10 citations82
US7242828B2Jul 10, 2007
Optical circuit in which fabrication is easy
NEC CORP9 citations74
US6829079B2Dec 7, 2004
Optical path control apparatus with mirror section, and manufacturing method for the same
NEC CORP12 citations74
US5241452AAug 31, 1993
Package with heat sink
NEC CORP15 citations74
US6670208B2Dec 30, 2003
Optical circuit in which fabrication is easy
NEC CORP3 citations63
US7483261B2Jan 27, 2009
Cooling device for an electronic equipment
NEC CORP6 citations62
US6430327B1Aug 6, 2002
Optical module and manufacturing method thereof
NEC CORP4 citations62
US7594644B2Sep 29, 2009
Semiconductor device and method for manufacturing the same, circuit board, electronic apparatus, and semiconductor device manufacturing apparatus
NEC CORP0 citations51
JAPAN E M CO LTD
3 patentsUS6926188B2Aug 9, 2005
Transfer apparatus for arraying small conductive bumps on a substrate and/ or chip
JAPAN E M CO LTD15 citations82
US6889886B2May 10, 2005
Transfer apparatus for arraying small conductive bumps on substrate and/ or chip
JAPAN E M CO LTD12 citations82
US7119438B2Oct 10, 2006
Method of arranging microspheres with liquid, microsphere arranging device, and semiconductor device
JAPAN E M CO LTD3 citations53
NITTO DENKO CORP
2 patentsISHIDA TOMOTAKA
2 patentsNEC TOPPAN CIRCUIT SOLUTIONS
2 patentsUS6999643B2Feb 14, 2006
Method of manufacturing optical waveguide and method of manufacturing opto-electric wiring board
NEC TOPPAN CIRCUIT SOLUTIONS4 citations62
US7106426B2Sep 12, 2006
Method of inspecting optical waveguide substrate for optical conduction at increased speed and also inspecting optical waveguide substrate for crosstalk
NEC TOPPAN CIRCUIT SOLUTIONS0 citations38