Inventor
KATAHIRA AKEO
JP3 patents
Patents
3 patentsUS6926188B2Aug 9, 2005
Transfer apparatus for arraying small conductive bumps on a substrate and/ or chip
JAPAN E M CO LTD15 citations82
US6889886B2May 10, 2005
Transfer apparatus for arraying small conductive bumps on substrate and/ or chip
JAPAN E M CO LTD12 citations82
US7119438B2Oct 10, 2006
Method of arranging microspheres with liquid, microsphere arranging device, and semiconductor device
JAPAN E M CO LTD3 citations53