Inventor
LAI DIANE
US4 patents
Patents
4 patentsUS6716737B2Apr 6, 2004
Method of forming a through-substrate interconnect
HEWLETT PACKARD DEVELOPMENT CO133 citations95
US6764605B2Jul 20, 2004
Particle tolerant architecture for feed holes and method of manufacturing
HEWLETT PACKARD DEVELOPMENT CO19 citations91
US6902872B2Jun 7, 2005
Method of forming a through-substrate interconnect
HEWLETT PACKARD DEVELOPMENT CO11 citations71
US7432582B2Oct 7, 2008
Method of forming a through-substrate interconnect
HEWLETT PACKARD DEVELOPMENT CO4 citations60