Inventor

SNYDER BARRY C

US5 patents

⚠️ This page may combine multiple inventors who share the name “SNYDER BARRY C”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

HEWLETT PACKARD DEVELOPMENT CO

4 patents

US6716737B2Apr 6, 2004

Method of forming a through-substrate interconnect

HEWLETT PACKARD DEVELOPMENT CO133 citations95

US6902872B2Jun 7, 2005

Method of forming a through-substrate interconnect

HEWLETT PACKARD DEVELOPMENT CO11 citations71

US7563691B2Jul 21, 2009

Method for plasma enhanced bonding and bonded structures formed by plasma enhanced bonding

HEWLETT PACKARD DEVELOPMENT CO3 citations61

US7432582B2Oct 7, 2008

Method of forming a through-substrate interconnect

HEWLETT PACKARD DEVELOPMENT CO4 citations60

CHEN CHIEN-HUA

1 patent

US8174094B2May 8, 2012

Bonded structures formed by plasma enhanced bonding

CHEN CHIEN-HUA0 citations51