Inventor
PLAS HUBERT VANDER
US3 patents
Patents
3 patentsUS6716737B2Apr 6, 2004
Method of forming a through-substrate interconnect
HEWLETT PACKARD DEVELOPMENT CO133 citations95
US6902872B2Jun 7, 2005
Method of forming a through-substrate interconnect
HEWLETT PACKARD DEVELOPMENT CO11 citations71
US7432582B2Oct 7, 2008
Method of forming a through-substrate interconnect
HEWLETT PACKARD DEVELOPMENT CO4 citations60