Inventor
SMITH SEAN P E
US6 patents
Patents
6 patentsUS7045453B2May 16, 2006
Very low effective dielectric constant interconnect structures and methods for fabricating the same
IBM221 citations99
US7023093B2Apr 4, 2006
Very low effective dielectric constant interconnect Structures and methods for fabricating the same
IBM112 citations98
US6975032B2Dec 13, 2005
Copper recess process with application to selective capping and electroless plating
IBM85 citations97
US7064064B2Jun 20, 2006
Copper recess process with application to selective capping and electroless plating
IBM22 citations92
US7407605B2Aug 5, 2008
Manufacturable CoWP metal cap process for copper interconnects
IBM8 citations73
US7253106B2Aug 7, 2007
Manufacturable CoWP metal cap process for copper interconnects
IBM1 citations51