Inventor
KARIYA TAKASHI
JP104 patents
⚠️ This page may combine multiple inventors who share the name “KARIYA TAKASHI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBIDEN CO LTD
40 patentsUS7435910B2Oct 14, 2008
Multilayer printed circuit board
IBIDEN CO LTD63 citations99
US6909054B2Jun 21, 2005
Multilayer printed wiring board and method for producing multilayer printed wiring board
IBIDEN CO LTD131 citations99
US6534723B1Mar 18, 2003
Multilayer printed-circuit board and semiconductor device
IBIDEN CO LTD316 citations99
US8971053B2Mar 3, 2015
Wiring board and method for manufacturing the same
IBIDEN CO LTD62 citations98
US6889433B1May 10, 2005
Method of manufacturing printed-circuit board
IBIDEN CO LTD81 citations98
US6440542B1Aug 27, 2002
Copper-clad laminated board, and circuit board for printed wiring board and method for producing the same
IBIDEN CO LTD92 citations98
US6376052B1Apr 23, 2002
Multilayer printed wiring board and its production process, resin composition for filling through-hole
IBIDEN CO LTD117 citations98
US6376049B1Apr 23, 2002
Multilayer printed wiring board and its manufacturing method, and resin composition for filling through-hole
IBIDEN CO LTD82 citations98
US7842887B2Nov 30, 2010
Multilayer printed circuit board
IBIDEN CO LTD45 citations96
US7462784B2Dec 9, 2008
Heat resistant substrate incorporated circuit wiring board
IBIDEN CO LTD50 citations96
US6609297B1Aug 26, 2003
Method of manufacturing multilayer printed wiring board
IBIDEN CO LTD59 citations96
US6407345B1Jun 18, 2002
Printed circuit board and method of production thereof
IBIDEN CO LTD48 citations96
US7894203B2Feb 22, 2011
Multilayer printed wiring board
IBIDEN CO LTD53 citations93
US7888606B2Feb 15, 2011
Multilayer printed circuit board
IBIDEN CO LTD14 citations93
US7649748B2Jan 19, 2010
Multilayer printed wiring board
IBIDEN CO LTD22 citations93
USRE40947EOct 27, 2009
Multilayer printed wiring board and its manufacturing method, and resin composition for filling through-hole
IBIDEN CO LTD20 citations93
US7332816B2Feb 19, 2008
Method of fabricating crossing wiring pattern on a printed circuit board
IBIDEN CO LTD19 citations93
US7127812B2Oct 31, 2006
Process for producing a multi-layer printed wiring board
IBIDEN CO LTD15 citations93
US8008583B2Aug 30, 2011
Heat resistant substrate incorporated circuit wiring board
IBIDEN CO LTD12 citations92
US7994432B2Aug 9, 2011
Heat resistant substrate incorporated circuit wiring board
IBIDEN CO LTD11 citations92
US7982139B2Jul 19, 2011
Multilayer printed wiring board
IBIDEN CO LTD21 citations92
US7843302B2Nov 30, 2010
Inductor and electric power supply using it
IBIDEN CO LTD12 citations92
US7812702B2Oct 12, 2010
Inductor and electric power supply using it
IBIDEN CO LTD21 citations92
US7497694B2Mar 3, 2009
Printed board with a pin for mounting a component
IBIDEN CO LTD14 citations92
US6762921B1Jul 13, 2004
Multilayer printed-circuit board and method of manufacture
IBIDEN CO LTD52 citations92
US7049528B2May 23, 2006
Semiconductor chip mounting wiring board, manufacturing method for same, and semiconductor module
IBIDEN CO LTD44 citations89
US9893016B2Feb 13, 2018
Multilayer wiring board having wiring structure for mounting multiple electronic components and method for manufacturing the same
IBIDEN CO LTD8 citations84
US9572256B2Feb 14, 2017
Printed wiring board, method for manufacturing printed wiring board, and package-on-package
IBIDEN CO LTD7 citations84
US8373069B2Feb 12, 2013
Electronic component mounting substrate and method for manufacturing electronic component mounting substrate
IBIDEN CO LTD10 citations84
US7888803B2Feb 15, 2011
Printed circuit board
IBIDEN CO LTD11 citations84
US7856710B2Dec 28, 2010
Method of manufacturing printed wiring board
IBIDEN CO LTD12 citations84
US7773388B2Aug 10, 2010
Printed wiring board with component mounting pin and electronic device using the same
IBIDEN CO LTD9 citations84
US7525190B2Apr 28, 2009
Printed wiring board with wiring pattern having narrow width portion
IBIDEN CO LTD10 citations84
US7495332B2Feb 24, 2009
Multilayer printed wiring board
IBIDEN CO LTD12 citations84
US7489521B2Feb 10, 2009
Multilayer printed wiring board
IBIDEN CO LTD8 citations84
US7480150B2Jan 20, 2009
Printed wiring board and method of manufacturing the same
IBIDEN CO LTD9 citations84
US8347493B2Jan 8, 2013
Wiring board with built-in electronic component and method of manufacturing same
IBIDEN CO LTD8 citations83
US8046914B2Nov 1, 2011
Method for manufacturing multilayer printed circuit board
IBIDEN CO LTD4 citations74
US7888605B2Feb 15, 2011
Multilayer printed circuit board
IBIDEN CO LTD3 citations74
US7884286B2Feb 8, 2011
Multilayer printed circuit board
IBIDEN CO LTD5 citations74
SAKAMOTO HAJIME
4 patentsUS8453323B2Jun 4, 2013
Printed circuit board manufacturing method
SAKAMOTO HAJIME12 citations92
US8186045B2May 29, 2012
Multilayer printed circuit board and multilayer printed circuit board manufacturing method
SAKAMOTO HAJIME14 citations92
US8079142B2Dec 20, 2011
Printed circuit board manufacturing method
SAKAMOTO HAJIME15 citations92
US8438727B2May 14, 2013
Multilayer printed circuit board and multilayer printed circuit board manufacturing method
SAKAMOTO HAJIME2 citations74
KARIYA TAKASHI
3 patentsMANO YASUHIKO
2 patentsHITACHI LTD
1 patentShowing the top 50 of 104 patents by PatentIndex Score.