Inventor
NALLA RAVI
US12 patents
⚠️ This page may combine multiple inventors who share the name “NALLA RAVI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
INTEL CORP
7 patentsUS8772924B2Jul 8, 2014
Forming in-situ micro-feature structures with coreless packages
INTEL CORP7 citations83
US7651021B2Jan 26, 2010
Microball attachment using self-assembly for substrate bumping
INTEL CORP13 citations82
US7538429B2May 26, 2009
Method of enabling solder deposition on a substrate and electronic package formed thereby
INTEL CORP8 citations79
US9040842B2May 26, 2015
Mechanical adhesion of copper metallization to dielectric with partially cured epoxy fillers
INTEL CORP1 citations61
US7985622B2Jul 26, 2011
Method of forming collapse chip connection bumps on a semiconductor substrate
INTEL CORP3 citations61
US7831115B2Nov 9, 2010
Optical die structures and associated package substrates
INTEL CORP2 citations61
US7825022B2Nov 2, 2010
Method of enabling solder deposition on a substrate and electronic package formed thereby
INTEL CORP4 citations57
NALLA RAVI
3 patentsUS8425785B2Apr 23, 2013
Mechanical adhesion of copper metallization to dielectric with partially cured epoxy fillers
NALLA RAVI2 citations53
US9726962B1Aug 8, 2017
Enhanced camera module mount
NALLA RAVI1 citations49
US9929097B2Mar 27, 2018
Mechanical adhesion of copper metallization to dielectric with partially cured epoxy fillers
NALLA RAVI0 citations48