Inventor

GURUMURTHY CHARAVANA

US2 patents

Patents

2 patents

US7538429B2May 26, 2009

Method of enabling solder deposition on a substrate and electronic package formed thereby

INTEL CORP8 citations79

US7825022B2Nov 2, 2010

Method of enabling solder deposition on a substrate and electronic package formed thereby

INTEL CORP4 citations57