Inventor

IMANISHI YASUKO

JP3 patents

⚠️ This page may combine multiple inventors who share the name “IMANISHI YASUKO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

FUKUNAGA TAKAHIRO

1 patent

US8946746B2Feb 3, 2015

Lead, wiring member, package part, metal part provided with resin and resin-sealed semiconductor device, and methods for producing same

FUKUNAGA TAKAHIRO2 citations56

PANASONIC IP MAN CO LTD

1 patent

US9960325B2May 1, 2018

Lead, wiring member, package part, metal part provided with resin and resin-sealed semiconductor device, and methods for producing same

PANASONIC IP MAN CO LTD0 citations47

IMANISHI YASUKO

1 patent

US8110904B2Feb 7, 2012

Lead frame for semiconductor device and method of manufacturing of the same

IMANISHI YASUKO0 citations40