Inventor
ISHIKAWA HISAO
JP28 patents
⚠️ This page may combine multiple inventors who share the name “ISHIKAWA HISAO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
NIPPON SODA CO
19 patentsUS3950420AApr 13, 1976
Cyclohexane derivatives
NIPPON SODA CO71 citations95
US4249937AFeb 10, 1981
Cyclohexane derivatives
NIPPON SODA CO54 citations93
US3989737ANov 2, 1976
2-Cyclohexene-1-one derivatives
NIPPON SODA CO48 citations92
US5110343AMay 5, 1992
Cyclohexenone derivatives
NIPPON SODA CO21 citations81
US3967950AJul 6, 1976
Combating weeds in rice with benzothiazole derivatives
NIPPON SODA CO28 citations80
US4075239AFeb 21, 1978
Cyclohexane derivatives
NIPPON SODA CO6 citations73
US4033754AJul 5, 1977
Substituted cyclohexene esters
NIPPON SODA CO14 citations73
US4011256AMar 8, 1977
Cyclohexane derivatives
NIPPON SODA CO14 citations73
US4515729AMay 7, 1985
Cyclohexane derivatives
NIPPON SODA CO10 citations72
US4504305AMar 12, 1985
Cyclohexenone derivatives, preparation and herbicidal use
NIPPON SODA CO10 citations72
US4482740ANov 13, 1984
5-Phenylcyclohexenone derivatives
NIPPON SODA CO8 citations72
US4008067AFeb 15, 1977
Oxacyclohexane derivatives
NIPPON SODA CO11 citations71
US4812161AMar 14, 1989
Thia (oxa) diazole derivatives
NIPPON SODA CO7 citations62
US3999974ADec 28, 1976
Barbituric acid derivatives
NIPPON SODA CO5 citations61
US4259105AMar 31, 1981
Diphenylamine derivatives
NIPPON SODA CO5 citations58
US4579971AApr 1, 1986
Cyclohexane derivatives
NIPPON SODA CO1 citations51
US3989504ANov 2, 1976
Herbicidal composition of 3,4-dihydro-2H-pyrane-2,4-diones and methods
NIPPON SODA CO1 citations51
US3972899AAug 3, 1976
α-Pyrone derivatives
NIPPON SODA CO1 citations51
US3967951AJul 6, 1976
Selective herbicides
NIPPON SODA CO1 citations50
OJI PAPER CO
3 patentsYAMASHITA NOBUO
2 patentsISHIKAWA TECH LABORATORY CO LTD
2 patentsUS12392015B2Aug 19, 2025
Printed wiring board, printed circuit board, and electronic component
ISHIKAWA TECH LABORATORY CO LTD0 citations51
US11802322B2Oct 31, 2023
Method for manufacturing solder product, solder, soldered component, printed wiring board, printed circuit board, wire, soldered product, flexible printed board, electronic component, method for manufacturing tin article, method for manufacturing tin intermediate product, tin intermediate product, and conductive member
ISHIKAWA TECH LABORATORY CO LTD0 citations51