Inventor

HONG MYEONG-HO

KR7 patents

⚠️ This page may combine multiple inventors who share the name “HONG MYEONG-HO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SAMSUNG ELECTRO MECH

2 patents

US10026681B2Jul 17, 2018

Fan-out semiconductor package

SAMSUNG ELECTRO MECH63 citations96

US7653990B2Feb 2, 2010

Manufacturing method of printed circuit board using an ink jet

SAMSUNG ELECTRO MECH20 citations90

SAMSUNG ELECTRONICS CO LTD

2 patents

US11594505B2Feb 28, 2023

Semiconductor package substrate and method of manufacturing semiconductor package using the same

SAMSUNG ELECTRONICS CO LTD0 citations61

US11114397B2Sep 7, 2021

Semiconductor package substrate and method of manufacturing semiconductor package using the same

SAMSUNG ELECTRONICS CO LTD0 citations61

CHO JAE-CHOON

2 patents

US8840967B2Sep 23, 2014

Method for manufacturing printed circuit board including flame retardant insulation layer

CHO JAE-CHOON0 citations37

US8216503B2Jul 10, 2012

Method for manufacturing printed circuit board using imprinting

CHO JAE-CHOON0 citations36

LEE CHOON-KEUN

1 patent

US8187518B2May 29, 2012

Method for manufacturing substrate by imprinting

LEE CHOON-KEUN1 citations40