P

Inventor

LIN KENG-JEN

TW16 patents
⚠️ This page may combine multiple inventors who share the name “LIN KENG-JEN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

UNITED MICROELECTRONICS CORP

15 patents
US9847247B2Dec 19, 2017

Method for filling gaps of semiconductor device and semiconductor device formed by the same

UNITED MICROELECTRONICS CORP284 citations97
US9793174B1Oct 17, 2017

FinFET device on silicon-on-insulator and method of forming the same

UNITED MICROELECTRONICS CORP22 citations92
US9418853B1Aug 16, 2016

Method for forming a stacked layer structure

UNITED MICROELECTRONICS CORP21 citations90
US9130014B2Sep 8, 2015

Method for fabricating shallow trench isolation structure

UNITED MICROELECTRONICS CORP8 citations84
US9685319B2Jun 20, 2017

Method for filling gaps of semiconductor device and semiconductor device formed by the same

UNITED MICROELECTRONICS CORP5 citations82
US9356125B1May 31, 2016

Manufacturing method of semiconductor structure

UNITED MICROELECTRONICS CORP7 citations82
US10366991B1Jul 30, 2019

Semiconductor device and manufacturing method thereof

UNITED MICROELECTRONICS CORP2 citations72
US9543408B1Jan 10, 2017

Method of forming patterned hard mask layer

UNITED MICROELECTRONICS CORP2 citations72
US10347640B1Jul 9, 2019

Method for forming semiconductor device

UNITED MICROELECTRONICS CORP4 citations64
US9117878B2Aug 25, 2015

Method for manufacturing shallow trench isolation

UNITED MICROELECTRONICS CORP3 citations62
US12527040B2Jan 13, 2026

Semiconductor device and method for fabricating the same

UNITED MICROELECTRONICS CORP0 citations58
US11990547B2May 21, 2024

Semiconductor device and method for fabricating the same

UNITED MICROELECTRONICS CORP0 citations58
US9570578B2Feb 14, 2017

Gate and gate forming process

UNITED MICROELECTRONICS CORP1 citations52
US10460925B2Oct 29, 2019

Method for processing semiconductor device

UNITED MICROELECTRONICS CORP0 citations51
US10043888B2Aug 7, 2018

Method for forming a semiconductor structure

UNITED MICROELECTRONICS CORP0 citations51

LIN KING-FU

1 patent