Inventor
YAGI YOSHIHIKO
JP27 patents
⚠️ This page may combine multiple inventors who share the name “YAGI YOSHIHIKO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD
10 patentsUS5686353ANov 11, 1997
Semiconductor device and manufacturing method thereof
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD119 citations97
US6207549B1Mar 27, 2001
Method of forming a ball bond using a bonding capillary
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD45 citations96
US6651320B1Nov 25, 2003
Method for mounting semiconductor element to circuit board
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD49 citations92
US6061248AMay 9, 2000
Semiconductor chip-mounting board providing a high bonding strength with a semiconductor chip mounted thereon
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD29 citations92
US6985363B2Jan 10, 2006
Card type recording medium and production method therefor
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD16 citations81
US7071090B2Jul 4, 2006
Semiconductor element having protruded bump electrodes
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD7 citations73
US6894387B2May 17, 2005
Semiconductor element having protruded bump electrodes
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD6 citations73
US6566165B1May 20, 2003
Method for mounting a semiconductor chip to a semiconductor chip-mounting board
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD4 citations63
US6966964B2Nov 22, 2005
Method and apparatus for manufacturing semiconductor device
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD6 citations59
US6787922B2Sep 7, 2004
Semiconductor chip—mounting board
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD0 citations52
PANASONIC CORP
7 patentsUS8018731B2Sep 13, 2011
Interconnect substrate and electronic circuit mounted structure
PANASONIC CORP13 citations84
US7845954B2Dec 7, 2010
Interconnecting board and three-dimensional wiring structure using it
PANASONIC CORP13 citations84
US7762819B2Jul 27, 2010
Substrate connecting member and connecting structure
PANASONIC CORP14 citations84
US7613010B2Nov 3, 2009
Stereoscopic electronic circuit device, and relay board and relay frame used therein
PANASONIC CORP17 citations84
US8033016B2Oct 11, 2011
Method for manufacturing an electrode and electrode component mounted body
PANASONIC CORP6 citations63
US7928566B2Apr 19, 2011
Conductive bump, method for manufacturing the conductive bump, semiconductor device and method for manufacturing the semiconductor device
PANASONIC CORP3 citations63
US7659148B2Feb 9, 2010
Bonding method and apparatus
PANASONIC CORP0 citations51
SAKURAI DAISUKE
5 patentsUS8134081B2Mar 13, 2012
Three-dimensional circuit board and its manufacturing method
SAKURAI DAISUKE7 citations84
US8120188B2Feb 21, 2012
Electronic component mounting structure and method for manufacturing the same
SAKURAI DAISUKE8 citations84
US8575751B2Nov 5, 2013
Conductive bump, method for producing the same, and electronic component mounted structure
SAKURAI DAISUKE6 citations73
US8119449B2Feb 21, 2012
Method of manufacturing an electronic part mounting structure
SAKURAI DAISUKE5 citations62
US8809693B2Aug 19, 2014
Three-dimensional circuit board
SAKURAI DAISUKE0 citations52
MORI MASATO
2 patentsHITACHI INFORMATION & TELECOMMUNICATION ENG LTD
2 patentsUS9402092B2Jul 26, 2016
Communication device, communication program, and communication method
HITACHI INFORMATION & TELECOMMUNICATION ENG LTD3 citations62
US9438379B2Sep 6, 2016
Communication device, communication program, communication method, and information processing device
HITACHI INFORMATION & TELECOMMUNICATION ENG LTD0 citations42