Inventor
CHEUNG DAVID
CN127 patents
⚠️ This page may combine multiple inventors who share the name “CHEUNG DAVID”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
APPLIED MATERIALS INC
47 patentsUS6596655B1Jul 22, 2003
Plasma processes for depositing low dielectric constant films
APPLIED MATERIALS INC77 citations99
US6562690B1May 13, 2003
Plasma processes for depositing low dielectric constant films
APPLIED MATERIALS INC102 citations99
US6541282B1Apr 1, 2003
Plasma processes for depositing low dielectric constant films
APPLIED MATERIALS INC80 citations99
US6511909B1Jan 28, 2003
Method of depositing a low K dielectric with organo silane
APPLIED MATERIALS INC100 citations99
US6511903B1Jan 28, 2003
Method of depositing a low k dielectric with organo silane
APPLIED MATERIALS INC91 citations99
US6348725B2Feb 19, 2002
Plasma processes for depositing low dielectric constant films
APPLIED MATERIALS INC161 citations99
US6303523B2Oct 16, 2001
Plasma processes for depositing low dielectric constant films
APPLIED MATERIALS INC751 citations99
US6187072B1Feb 13, 2001
Method and apparatus for reducing perfluorocompound gases from substrate processing equipment emissions
APPLIED MATERIALS INC154 citations99
US6171945B1Jan 9, 2001
CVD nanoporous silica low dielectric constant films
APPLIED MATERIALS INC317 citations99
US6072227AJun 6, 2000
Low power method of depositing a low k dielectric with organo silane
APPLIED MATERIALS INC541 citations99
US6054379AApr 25, 2000
Method of depositing a low k dielectric with organo silane
APPLIED MATERIALS INC609 citations99
US6039834AMar 21, 2000
Apparatus and methods for upgraded substrate processing system with microwave plasma source
APPLIED MATERIALS INC242 citations99
US5908672AJun 1, 1999
Method and apparatus for depositing a planarized passivation layer
APPLIED MATERIALS INC593 citations99
US6660656B2Dec 9, 2003
Plasma processes for depositing low dielectric constant films
APPLIED MATERIALS INC111 citations98
US6537929B1Mar 25, 2003
CVD plasma assisted low dielectric constant films
APPLIED MATERIALS INC118 citations98
US6358573B1Mar 19, 2002
Mixed frequency CVD process
APPLIED MATERIALS INC130 citations98
US6287990B1Sep 11, 2001
CVD plasma assisted low dielectric constant films
APPLIED MATERIALS INC233 citations98
US6245690B1Jun 12, 2001
Method of improving moisture resistance of low dielectric constant films
APPLIED MATERIALS INC132 citations98
US6194628B1Feb 27, 2001
Method and apparatus for cleaning a vacuum line in a CVD system
APPLIED MATERIALS INC170 citations98
US6193802B1Feb 27, 2001
Parallel plate apparatus for in-situ vacuum line cleaning for substrate processing equipment
APPLIED MATERIALS INC191 citations98
US6077764AJun 20, 2000
Process for depositing high deposition rate halogen-doped silicon oxide layer
APPLIED MATERIALS INC91 citations98
US6045618AApr 4, 2000
Microwave apparatus for in-situ vacuum line cleaning for substrate processing equipment
APPLIED MATERIALS INC130 citations98
US5911834AJun 15, 1999
Gas delivery system
APPLIED MATERIALS INC133 citations98
US5792269AAug 11, 1998
Gas distribution for CVD systems
APPLIED MATERIALS INC164 citations98
US5158644AOct 27, 1992
Reactor chamber self-cleaning process
APPLIED MATERIALS INC222 citations98
US6734115B2May 11, 2004
Plasma processes for depositing low dielectric constant films
APPLIED MATERIALS INC67 citations97
US6448187B2Sep 10, 2002
Method of improving moisture resistance of low dielectric constant films
APPLIED MATERIALS INC98 citations97
US6098568AAug 8, 2000
Mixed frequency CVD apparatus
APPLIED MATERIALS INC106 citations97
US6086952AJul 11, 2000
Chemical vapor deposition of a copolymer of p-xylylene and a multivinyl silicon/oxygen comonomer
APPLIED MATERIALS INC93 citations97
US7023092B2Apr 4, 2006
Low dielectric constant film produced from silicon compounds comprising silicon-carbon bonds
APPLIED MATERIALS INC25 citations96
US6869896B2Mar 22, 2005
Plasma processes for depositing low dielectric constant films
APPLIED MATERIALS INC37 citations96
US6770556B2Aug 3, 2004
Method of depositing a low dielectric with organo silane
APPLIED MATERIALS INC29 citations96
US6730593B2May 4, 2004
Method of depositing a low K dielectric with organo silane
APPLIED MATERIALS INC60 citations96
US6562544B1May 13, 2003
Method and apparatus for improving accuracy in photolithographic processing of substrates
APPLIED MATERIALS INC53 citations96
US6517913B1Feb 11, 2003
Method and apparatus for reducing perfluorocompound gases from substrate processing equipment emissions
APPLIED MATERIALS INC65 citations96
US6361707B1Mar 26, 2002
Apparatus and methods for upgraded substrate processing system with microwave plasma source
APPLIED MATERIALS INC39 citations96
US6230652B1May 15, 2001
Apparatus and methods for upgraded substrate processing system with microwave plasma source
APPLIED MATERIALS INC43 citations96
US6209484B1Apr 3, 2001
Method and apparatus for depositing an etch stop layer
APPLIED MATERIALS INC74 citations96
US6156149ADec 5, 2000
In situ deposition of a dielectric oxide layer and anti-reflective coating
APPLIED MATERIALS INC71 citations96
US6127262AOct 3, 2000
Method and apparatus for depositing an etch stop layer
APPLIED MATERIALS INC49 citations96
US6107184AAug 22, 2000
Nano-porous copolymer films having low dielectric constants
APPLIED MATERIALS INC52 citations96
US5968324AOct 19, 1999
Method and apparatus for depositing antireflective coating
APPLIED MATERIALS INC85 citations96
US6800571B2Oct 5, 2004
CVD plasma assisted low dielectric constant films
APPLIED MATERIALS INC54 citations95
US6743737B2Jun 1, 2004
Method of improving moisture resistance of low dielectric constant films
APPLIED MATERIALS INC39 citations95
US6680420B2Jan 20, 2004
Apparatus for cleaning an exhaust line in a semiconductor processing system
APPLIED MATERIALS INC45 citations95
US6660663B1Dec 9, 2003
Computer readable medium for holding a program for performing plasma-assisted CVD of low dielectric constant films formed from organosilane compounds
APPLIED MATERIALS INC62 citations95
US6083852AJul 4, 2000
Method for applying films using reduced deposition rates
APPLIED MATERIALS INC69 citations95
WANG BING
2 patentsCARBOMEDICS INC
1 patentShowing the top 50 of 127 patents by PatentIndex Score.